RF Filters

2021 ◽  
pp. 209-237
Keyword(s):  
2021 ◽  
Author(s):  
D. Kim ◽  
G. Moreno ◽  
F. Bi ◽  
M. Winters ◽  
R. Houlden ◽  
...  
Keyword(s):  

Author(s):  
Chady Kharrat ◽  
Eric Colinet ◽  
Laurent Duraffourg ◽  
Sebastien Hentz ◽  
Philippe Andreucci ◽  
...  
Keyword(s):  

1997 ◽  
Vol 482 ◽  
Author(s):  
C. R. Gorla ◽  
S. Liang ◽  
N. Emanetoglu ◽  
W. E. Mayo ◽  
Y. Lu

AbstractZnO films are being used in many emerging technologies such as high frequency RF filters, substrate/buffer layer for GaN deposition, and as active layers in blue-UV LEDs and lasers. These applications require epitaxial films with high structural quality. In the present paper, results on the structure of ZnO films deposited by MOCVD on c-plane and r-plane sapphire substrates are presented. These films have been investigated by XRD, SEM and TEM. X-ray phi-scans show that the films have a single epitaxial relationship with each substrate orientation. (11.0) ZnO grows on (01.2) sapphire (r-plane), while (00.1) oriented films grow on (00.1) sapphire (c-plane). Smooth films are obtained on r-sapphire, while films with a columnar morphology are obtained on c-sapphire. Based on the morphology of the columnar grains grown on c-sapphire, it is expected that the films are oxygen terminated. The interface between ZnO and sapphire is atomically sharp as observed by HRTEM. Misfit dislocations at the interface between ZnO and r-sapphire have been observed. Grain boundaries between coalescing islands during film growth are the main type of defects. Under certain conditions, very long whiskers were observed to grow by the VLS mechanism. By modifying our system, we have been able to prevent the growth of these whiskers.


2019 ◽  
Vol 2019 (1) ◽  
pp. 000046-000050
Author(s):  
Ralf Schmidt

Abstract Next generation mobile devices, especially those with 5G capability, will require higher functionality and speed in combination with shrinking component as well as package dimensions. These requirements pose challenges to upcoming heterogeneous integration. In order to account for the increasingly complex technologies, filling of vias with copper will be required for packaging of the various components. Examples for such via filling applications include next generation radio frequency (RF) filters and multilayer redistribution layers (RDLs). However, the size scales of these applications vary from 100 μm to sub 5 μm. In addition to via filling of different dimensions and aspect ratios, the copper electrodeposition process is also supposed to be able to plate lines and pads within the RDLs. A combination of electrochemical and spectroscopic experiments was applied to optimize organic plating additives with respect to their suitability to deposit copper into this broad variety of structures.


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