Development and research of metal-cladding additive to lubricants

The article indicates that one of the directions of increasing the wear resistance of rubbing parts of machines and equipment, reducing friction losses and temperatures in the friction zone is the use of special metal-plating additives to lubricants. The Engineering Center of the Timiryazev Academy has developed an experimental metal-cladding additive under the code name “MP-21” based on a mixture of fatty acids (oleic, stearic, linoleic) and plastic metal salts of the same fatty acids. The tribotechnical properties of lubricating compositions with various additives in recommended concentrations were investigated on a modernized Timken-mashine friction machine in a steady state using samples from real rolling bearing assemblies. It has been established that the developed metal-cladding additive “MP-21”, along with the additive Renom Engine, provides maximum antiwear properties and allows to reduce the wear of rubbing samples in comparison with other investigated additives from 30% to several.

Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation Packaging

Next generation mobile devices, especially those with 5G capability, will require higher functionality and speed in combination with shrinking component as well as package dimensions. These requirements pose challenges to upcoming heterogeneous integration. In order to account for the increasingly complex technologies, filling of vias with copper will be required for packaging of the various components. Examples for such via filling applications include next generation radio frequency (RF) filters and multilayer redistribution layers (RDLs). However, the size scales of these applications vary from 100 μm to sub 5 μm. In addition to via filling of different dimensions and aspect ratios, the copper electrodeposition process is also supposed to be able to plate lines and pads within the RDLs. A combination of electrochemical and spectroscopic experiments was applied to optimize organic plating additives with respect to their suitability to deposit copper into this broad variety of structures.