Hyperbranched‐polysiloxane‐based hyperbranched polyimide films with low dielectric permittivity and high mechanical and thermal properties

2019 ◽  
Vol 136 (31) ◽  
pp. 47771 ◽  
Author(s):  
Ruhe Lian ◽  
Xingfeng Lei ◽  
Yanhui Chen ◽  
Qiuyu Zhang
Keyword(s):  
Thermal Properties ◽  
Dielectric Permittivity ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Hyperbranched Polysiloxane

Hyperbranched polysiloxane (HBPSi)-based polyimide films with ultralow dielectric permittivity, desirable mechanical and thermal properties

2016 ◽  
Vol 4 (11) ◽  
pp. 2134-2146 ◽  
Author(s):  
Xingfeng Lei ◽  
Yanhui Chen ◽  
Mingtao Qiao ◽  
Lidong Tian ◽  
Qiuyu Zhang
Keyword(s):  
Thermal Properties ◽  
Dielectric Permittivity ◽  
Polyimide Film ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Comprehensive Properties ◽  
Hyperbranched Polysiloxane

A 35 wt% HBPSi polyimide film exhibits an ultralow dielectric permittivity (2.24), accompanied by the most desirable comprehensive properties.

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Low Dielectric Constant ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Low Dielectric

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.

Composition design and properties investigation of BPDA/PDA/TFDB co‐polyimide films with low dielectric permittivity

2019 ◽  
Vol 136 (39) ◽  
pp. 47989 ◽  
Author(s):  
Xiaolan Li ◽  
Huanyu Lei ◽  
Jiacong Guo ◽  
Jianhua Wang ◽  
Shengli Qi ◽  
...  
Keyword(s):  
Dielectric Permittivity ◽  
Polyimide Films ◽  
Composition Design ◽  
Low Dielectric

scholarly journals Preparation and properties of a novel graphene fluoroxide/polyimide nanocomposite film with a low dielectric constant

RSC Advances ◽  
2017 ◽  
Vol 7 (4) ◽  
pp. 1956-1965 ◽  
Author(s):  
Xiao Chen ◽  
Haohao Huang ◽  
Xia Shu ◽  
Shumei Liu ◽  
Jianqing Zhao
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Nanocomposite Film ◽  
Low Dielectric Constant ◽  
Mechanical And Thermal Properties ◽  
Low Dielectric ◽  
Polyimide Nanocomposite

A novel graphene fluoroxide/polyimide nanocomposite film with a low dielectric constant is prepared with excellent mechanical and thermal properties.

Enhanced Mechanical and Thermal Properties of Polyimide Films Based on Functional Groups-Free Few-Layer Graphene

2019 ◽  
Vol 52 (6) ◽  
pp. 570-578 ◽  
Author(s):  
Rubing Wang ◽  
Mingliang Chen ◽  
Qi Li ◽  
Weiwei Li ◽  
Yufen Guo ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Functional Groups ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Layer Graphene ◽  
Few Layer Graphene

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Jisu Jiang ◽  
Landon Keller ◽  
Paul A. Kohl
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Maleic Anhydride ◽  
Coefficient Of Thermal Expansion ◽  
Tangent Loss ◽  
Mechanical And Thermal Properties ◽  
Low Dielectric ◽  
Resin Formulation ◽  
Styrene Maleic Anhydride ◽  
Poly Propylene

Abstract Epoxide functionalized poly(propylene carbonate) (ePPC) was included in an epoxy resin formulation and thermally decomposed to create nanoporous epoxy film. The dielectric constant of the porous epoxy was lower than the epoxy formulation control. The introduction of 30% porosity in the epoxy lowered the dielectric constant from 3.78 to 2.76. A postporosity chemical treatment further lowered the dielectric constant. Hexamethyldisilazane (HMDS) was used to terminate the pore walls with the hydrophobic silane layer and reduce both the dielectric constant and tangent loss of the porous epoxy. Two different styrene maleic anhydride crosslinking agents were used in the epoxy formulation, styrene maleic anhydride 2000 (SMA2000) and styrene maleic anhydride 4000 (SMA4000). The effect of the maleic anhydride concentration within SMA on the electrical, mechanical, and thermal properties of porous epoxy film was evaluated. Epoxy films crosslinked with SMA2000 resulted in films with a higher dielectric constant compared to films prepared with SMA4000 due to higher mole fraction of maleic anhydride within SMA2000. However, SMA2000 crosslinked films yielded films with better mechanical and thermal properties. SMA2000 crosslinked films with 30% porosity had a coefficient of thermal expansion (CTE) of 35.2 ppm/K and glass transition temperature of 143 °C.

Mechanical and Thermal Properties of PMMA with Al2O3 Composite Films

2011 ◽  
Vol 3 (6) ◽  
pp. 455-456
Author(s):  
Anita Anita ◽  
◽  
Basavaraja Sannakki
Keyword(s):  
Thermal Properties ◽  
Composite Films ◽  
Mechanical And Thermal Properties ◽  
Al2o3 Composite
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