Principles of plasma discharges and materials processing. Von.M. A. Liebermann undA. J. Lichtenberg, XXVI, 572S., John Wiley & Sons, Inc., New York 1994, £ 54.00, ISBN 0-471-00577-0

1995 ◽  
Vol 46 (9) ◽  
pp. 551-551 ◽  
Author(s):  
D. Petersohn
MRS Bulletin ◽  
1996 ◽  
Vol 21 (8) ◽  
pp. 32-37 ◽  
Author(s):  
M.A. Lieberman ◽  
G.S. Selwyn ◽  
M. Tuszewski

Chemically reactive plasma discharges are widely used to process materials. A plasma is a primarily electrically neutral collection of free charged particles moving in random directions. The simplest plasma consists of electrons and one kind of positive ions. This article deals primarily with plasma discharges, which are plasmas having the following features:(1) They are driven electrically.(2) Charged-particle collisions with neutral-gas molecules are important.(3) There are boundaries at which surface losses are important.(4) Ionization of neutrals sustains the plasma in the steady state.One simple discharge consists of a voltage source that drives current through a low-pressure gas between two conducting plates or electrodes. The gas “breaks down” to form a plasma, usually weakly ionized—that is, the plasma density is only a small fraction of the neutral-gas density.The plasmas used in materials processing present an enormous range of charged-particle densities n and of temperatures Te, Ti, and T for electrons, ions, and processing gas, respectively. High-pressure (atmospheric) discharges are in near-thermal equilibrium (Te ~ Ti ~ T ~ 0.1–2 eV). Plasma temperatures are usually given in equivalent electron-volt units: One eV is equivalent to 11600 K through the Boltzmann constant. As discussed in the article by Boulos and Pfender in this issue of MRS Bulletin, these thermal discharges have high densities n ~ 1014-1019 particles/cm3 and are mainly used as heat sources. Low-pressure (1 mTorr–10 Torr) discharges are not in thermal equilibrium (Te ~ 2–5 eV ≫ Ti ~ T) and have low densities n ~ 109–1012 particles/cm3. As discussed in several of the following articles, these discharges are used as miniature chemical factories in which feedstock gases are broken into positive ions and chemically reactive etchants, deposition precursors, etc., which then flow to and physically or chemically react at the surface of a substrate.


2005 ◽  
Author(s):  
Michael A. Lieberman ◽  
Allan J. Lichtenberg

MRS Bulletin ◽  
1990 ◽  
Vol 15 (2) ◽  
pp. 63-65 ◽  
Author(s):  
Sonia K. Ellis ◽  
Edward P. McNamara

The Center for Advanced Materials Processing (CAMP) was established in 1985 by Clarkson University in Potsdam, New York. At that time, nearly half of the research at Clarkson was materials-related but was conducted in seven separate departments of science and engineering. To coordinate and encourage this strong materials program, CAMP was created as an interdisciplinary center dedicated to research on high-technology materials processing.The current corporate sponsors of CAMP are Corning Incorporated, Eastman Kodak, Xerox Corporation, and IBM. These and over 30 other industrial members support individual research projects. In 1987 the New York State Science and Technology Foundation designated CAMP as the New York State Center for Advanced Materials Processing, entitling CAMP to $1 million per year in operating funds. In addition, CAMP is supported by federal and University sources.In its role as an education and research initiative, CAMP has three goals:1. Enhance Clarkson University's expertise and reputation as a center of excellence in materials processing research.2. Greatly increase the mutually beneficial relationships between industrial organizations and the University; and3. Strengthen graduate and undergraduate education in materials processing.Innovative research by Egon Matijević, Distinguished University Professor, has contributed greatly to the development of the fundamental principles for the formation and interactions of colloidal dispersions. Using Matijević's work as a foundation, CAMP has developed four programs in high-technology materials research: electronic materials processing, fine-particle processing, particulate control in process equipment, and polymer processing.


2011 ◽  
Vol 77 (6) ◽  
pp. 829-841
Author(s):  
ROBERT W. JOHNSON

AbstractThe model by Braginskii [1] (Braginskii, S. I. 1965 Transport processes in plasma. In: Review of Plasma Physics, Vol. 1 (ed. M.A. Leontovich). New York, NY: Consultants Bureau, pp. 205–311) for the viscous stress tensor is used to determine the shear and gyroviscous forces acting within a toroidally confined plasma. Comparison is made to a previous evaluation, which contains an inconsistent treatment of the radial derivative and neglects the effect of the pitch angle. Parallel viscosity contributes a radial shear viscous force, which may develop for sufficient vertical asymmetry to the ion velocity profile. An evaluation is performed of this radial viscous force for a tokamak near equilibrium, which indicates qualitative agreement between theory and measurement for impure plasma discharges with strong toroidal flow.


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