scholarly journals A temperature-based formulation for finite element analysis of generalized phase-change problems

1994 ◽  
Vol 37 (20) ◽  
pp. 3441-3465 ◽  
Author(s):  
Dsego Celentano ◽  
Eugenio Oñate ◽  
Sergio Oller
2013 ◽  
Vol 534 ◽  
pp. 136-140
Author(s):  
Rosalena Irma Alip ◽  
Ryota Kobayashi ◽  
Yu Long Zhang ◽  
Zulfakri bin Mohamad ◽  
You Yin ◽  
...  

A novel phase change memory structure with a separate heater was proposed for a multilevel storage. Finite element analysis was conducted to investigate the possibility of multilevel storage. 100 ns SET pulses, with an increasing amplitude from 0.5 V to 3 V, were applied for heating the phase change layer, Ge2Se2T5 (GST). From the simulation result, it was exhibited that the temperature in the GST layer increased gradually when an increasing pulse is applied to the separate heater layer (N-TiSi3). This implies that crystallization is well controlled by changing the amplitude of the applied SET pulse. The gradual increase in the temperature leads to gradual resistance drop, depending strongly on the capping material. The gradual resistance drop will allow multilevel storage for the memory device.


2011 ◽  
Vol 497 ◽  
pp. 106-110
Author(s):  
You Yin ◽  
Sumio Hosaka

Performance of lateral phase change memories (LPCMs) is investigated by both electrical characterization and finite element analysis. Ge2Sb2Te5 lateral PCMs (GST-LPCMs) exhibit a low reset current but a bad endurance. By replacing GST with Sb2Te3 (ST) and adding a TiN layer between ST and electrodes, the ST-TiN-LPCMs are demonstrated to have a much improved endurance. Finite element analysis of the LPCMs with electric-thermal structural interaction shows that thermal confinement makes GST-LPCMs low-power consumptive but that high level stress makes them readily broken. In contrast, ST-TiN-LPCMs experience low level stress during operation but high power consumption is required.


2013 ◽  
Vol 750-752 ◽  
pp. 1211-1214
Author(s):  
Shu Yang

Phase change material has been widely used in the fields of solar energy, aerospace, aviation, and buildings. In this paper, paraffin is applied in the thermal design of electronic equipment, in order to maintain a constant working circumstance. Finite-element analysis is implemented to analyze the feasibility of this thermal design.


2016 ◽  
Vol 51 (6) ◽  
pp. 733-743
Author(s):  
Muhammad Owais Raza Siddiqui ◽  
Danmei Sun

The thermal property of textile structures plays an important role in the understanding of thermal behaviour of the clothing. In this work, user-friendly GUI plug-ins have been developed to generate both microscopic and mesoscopic scale models for finite element analysis. The plug-ins were developed by using Abaqus/CAE as a platform. The GUI Plug-ins enable automatic model generation and prediction of the effective thermal conductivity of woven composite and microencapsulated Phase Change Materials composites via finite element analysis by applying boundary conditions. The predicted effective thermal conductivities from plug-ins have been compared with the results obtained from published experimental research work based on an established mathematical model. They are correlated well. Moreover, the influence of phase change materials on heat transfer behaviour of microencapsulated Phase Change Materials composites was further analysed.


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