Amalgam tattoos: Light and electron microscopy and electron-probe micro-analysis

The structures of three families of thick film resistors have been investigated by scanning electron microscopy and electron probe micro-analysis. The two principal components of the resistive glazes, that is the conducting pigment and the glassy binder, have been identified in each case. The pigments were found to be simple or ternary oxides of the Pt transition metal group and Pd/PdO/Ag alloys. The glassy binders were based on lead borosilicate glasses.A model for the electronic conduction processes through the glass and pigments is proposed on the basis of the observed physical structures, the measured electrical properties of resistors and the properties of the component resistor materials.Part I of the total paper is concerned with identifying the phases in various Thick Film Resistors and part II considers the conduction processes that are appropriate.

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Microstructural Observation on Materials of the Japanese Sword under Fold-Forging Process

Materials Science Forum ◽

10.4028/www.scientific.net/msf.654-656.134 ◽

2010 ◽

Vol 654-656 ◽

pp. 134-137 ◽

Cited By ~ 4

Author(s):

Go Takami ◽

Takuya Ohba ◽

Shigekazu Morito ◽

Ananda Kumar Das

Keyword(s):

Electron Microscopy ◽

Electron Probe ◽

Nonmetallic Inclusions ◽

Special Kind ◽

Spherical Shape ◽

Electron Probe Micro Analysis ◽

Microstructural Observation ◽

Forging Process ◽

Micro Analysis ◽

Scanning Electron

The Japanese sword is produced from a special kind of steel called tamahagane, using a forge-fold operation repeated several times. The purpose of this study is to clarify the development of microstructures with successive forge-fold operations using tamahagane. Specimens under several stages of sword making have been investigated with optical microscopy, scanning electron microscopy and electron probe micro analysis methods. Microstructures have been found to be a combination of ferrite and pearlite with a lot of nonmetallic inclusions. The ferrite bands become finer and among other inclusions Fe2SiO4 takes a spherical shape with increasing recurrence of forge-fold operations.

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Conduction Processes in Thick Film Resistors. Part II

ElectroComponent Science and Technology ◽

10.1155/apec.3.141 ◽

1976 ◽

Vol 3 (3) ◽

pp. 141-151 ◽

Cited By ~ 9

Author(s):

M. P. Ansell

Keyword(s):

Electron Microscopy ◽

Scanning Electron Microscopy ◽

Thick Film ◽

Electron Probe ◽

Electronic Conduction ◽

Borosilicate Glasses ◽

Electron Probe Micro Analysis ◽

Metal Group ◽

Micro Analysis ◽

Scanning Electron

The structures of three families of thick film resistors have been investigated by scanning electron microscopy and electron probe micro-analysis. The two principal components of the resistive glazes, that is the conducting pigment and the glassy binder, have been identified in each case. The pigments were found to be simple or ternary oxides of the Pt transition metal group and Pd/PdO/Ag alloys. The glassy binders were based on lead borosilicate glasses.A model for the electronic conduction processes through the glass and pigments is proposed on the basis of the observed physical structures, the measured electrical properties of resistors and the properties of the component resistor materials.Part I of the total paper is concerned with identifying the phases in various thick film resistors and part II considers the conduction processes that are applicable.

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Surface Studies in Tribological Research and Failure Investigation

Volume 1A: General ◽

10.1115/70-gt-48 ◽

1970 ◽

Author(s):

D. Scott

Keyword(s):

Electron Microscopy ◽

Electron Probe ◽

Chemical Nature ◽

Failure Mechanisms ◽

Controlling Factors ◽

Point Of View ◽

Electron Probe Micro Analysis ◽

Failure Investigation ◽

Surface Failure ◽

Micro Analysis

Progress in wear prevention can be aided by a better understanding of the mechanisms of surface failure. Changes in topography, chemical nature and physical properties of surfaces subjected to sliding, rolling, abrasion, corrosion, deformation and repeated stressing have been studied. Optical and electron microscopy and electron probe micro-analysis have been used to obtain information for the elucidation of failure mechanisms and their controlling factors. The paper reviews some of this work which has been carried out in recent years in NEL mainly from the technological point of view.

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