A failure mechanism consistency test method for accelerated degradation test

Author(s):  
Guofu Zhai ◽  
Bokai Zheng ◽  
Xuerong Ye ◽  
Shuang Si ◽  
Enrico Zio
2006 ◽  
Vol 317-318 ◽  
pp. 577-580 ◽  
Author(s):  
Hyun Gyu Shin ◽  
Yong Nam Kim ◽  
Jun Kwang Song ◽  
Hee Soo Lee

Thermal degradation of indium tin oxide (ITO) thin film has been investigated. ITO thin film was fabricated on glass substrate using RF magnetron sputtering and was characterized. The resistivity of the film which was thermally degraded at high temperatures in air atmosphere was increased highly. Thermally-degraded specimen was analyzed using XPS and Hall measurement to reveal failure mechanism. Result showed that failure mechanism was the decrease in charge carrier concentration and mobility due to oxygen diffusion and chemisorption. Accelerated degradation test (ADT) was performed to predict the lifetime of ITO thin film. The lifetime under normal operating condition could be predicted via statistical analysis and modeling of data acquired from ADT of a short period.


1994 ◽  
Vol 34 (1-4) ◽  
pp. 473-483 ◽  
Author(s):  
Sanekazu Igari ◽  
Junta Nose ◽  
Tsunekichi Hiruma ◽  
Fumiaki Nagamine ◽  
Kazuya Fujisawa

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