Kinetics of Colloidal Particle Deposition on Solid Surfaces

1995 ◽  
Vol 175 (1) ◽  
pp. 6-11 ◽  
Author(s):  
Anatoly A. Bochkarev ◽  
Maxim V. Pukhovoy ◽  
Lyubov N. Kasyanova
Soft Matter ◽  
2020 ◽  
Vol 16 (15) ◽  
pp. 3649-3656
Author(s):  
Zhibin Yan ◽  
Xiaoyang Huang ◽  
Lingling Shui ◽  
Chun Yang

The colloidal particle deposition in microchannels is significantly affected by the collective effects of the temperature gradient and the bulk solution temperature during the two deposition steps: the particle transport and the particle attachment.


2001 ◽  
Vol 242 (1) ◽  
pp. 14-24 ◽  
Author(s):  
Zbigniew Adamczyk ◽  
Barbara Siwek ◽  
Piotr Warszyński ◽  
Elizeusz Musiał

MRS Bulletin ◽  
1990 ◽  
Vol 15 (1) ◽  
pp. 41-47 ◽  
Author(s):  
Nikola Kallay

The adhesion of particles at solid surfaces in liquid media has attracted the attention of scientists because of its various applications as well as the theoretical significance of the processes involved. Early studies were characterized either by poorly defined systems or limited by the properties of a few morphologically well-defined model colloids, such as latex dispersions. Consequently, results were either of semiquantitative nature or were related to some specific cases, which eluded general conclusions. New methods for preparing uniform particles of different compositions, shapes, and sizes make it possible to approach the problem in a more comprehensive manner. For example, to demonstrate difficulties caused by polydispersity, it is sufficient to mention that the electrostatic interaction energy between a plane surface and a particle is approximately proportional to the particle radius, yet the rate of deposition depends exponentially on the height of the energy barrier.In principle, static and dynamic approaches may be employed in the study of particle adhesion. The static method yields the force required to detach an adhered particle, while kinetic investigations of attachment and detachment give the rates of the respective processes. Both methods offer information on the stability of the system in terms of the bond strength of adhered solids. For small colloid particles, which are the subject of thermal random Brownian motion, the dynamic approach is more appropriate. This article emphasizes the kinetics of deposition and detachment of small colloid particles in liquid media.


Langmuir ◽  
2003 ◽  
Vol 19 (17) ◽  
pp. 6594-6597 ◽  
Author(s):  
Menachem Elimelech ◽  
Jeffrey Y. Chen ◽  
Zachary A. Kuznar

Author(s):  
Jan Zawała ◽  
Piotr Zawała ◽  
Kazimierz Małysa

AbstractThe kinetics of collision and bouncing of an air bubble on hydrophilic and hydrophobic solid surfaces immersed in distilled water is reported. We carried out the experiments and compared the bubble collision and bouncing courses on the stagnant and vibrating, with a controlled frequency and amplitude, solid/liquid interface. For stagnant interface differences in the outcome of the bubble collisions with hydrophilic and hydrophobic solid surfaces are resulting from different stability of the intervening liquid film formed between the colliding bubble and these surfaces. The liquid film was unstable at Teflon surface, where the three-phase contact (TPC) and the bubble attachment were observed, after dissipation of most of the kinetic energy associated with the bubble motion. For vibrated solid surface it was shown that kinetics of the bubble bouncing is independent on the hydrophilic/hydrophobic properties of the surface. Similarly like at water/glass hydrophilic interface, even at highly hydrophobic Teflon surface time of the bubble collisions and bouncing was prolonged almost indefinitely. This was due to the fact that the energy dissipated during the collision was re-supplied via interface vibrations with a properly adjusted acceleration. The analysis of the bubble deformation degree showed that this effect is related to a constant bubble deformation, which determined constant radius of the liquid film, large enough to prevent the draining liquid film from reaching the critical thickness of rupture at the moment of collision. The results obtained prove that mechanism of the bubble bouncing from various interfaces depends on interrelation between rates of two simultaneously going processes: (i) exchange between kinetic and surface energies of the system and (ii) drainage of the liquid film separating the interacting interfaces.


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