Protection and Diagnosis of Smart Power High-Side Switches in Automotive Applications

2008 ◽  
pp. 71-90
Author(s):  
Andreas Kucher
1990 ◽  
Author(s):  
Marise Bafleur ◽  
J. Buxo ◽  
A. Elmoznine ◽  
P. Rossel

2020 ◽  
Vol 2020 (1) ◽  
pp. 000015-000020
Author(s):  
Min Chu ◽  
Jie Chen ◽  
Abidur Rahman ◽  
Rajen Murugan

Abstract Generally, IC packages with exposed pads have excellent thermal and electrical performance – assuming high fidelity and integrity of die attach material. However, reliability challenges associated with die attach impacts electrical performance of vertical power FETs for high-side power switches. As such, it is critical to quantify the impact of these challenges on high-side power switches operation, so that their protection and diagnostic feature circuitries can be properly designed for mission critical applications. In this paper we present on a package and PCB co-modeling methodology that was developed to assess impact of die attach integrity on performance of high-side power switch designs. We explain how electrical co-optimization of the system (viz. FET-Package-PCB) interactions, was achieved through a coupled circuit-to-electromagnetic modeling, simulation, and analysis methodology. Silicon laboratory measurements data that validate the modeling methodology will be presented.


2011 ◽  
pp. 89-104
Author(s):  
Paolo Del Croce ◽  
Bernd Deutschmann
Keyword(s):  

1990 ◽  
Vol 37 (4) ◽  
pp. 1154-1161 ◽  
Author(s):  
A. Elmoznine ◽  
J. Buxo ◽  
M. Bafleur ◽  
P. Rossel

1987 ◽  
Author(s):  
Brad Marshall ◽  
Raymond Dewey

1987 ◽  
Vol 1987-13 (1) ◽  
pp. 11-19
Author(s):  
J. Tihanyi

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