A Critical Appraisal of Dental Adhesion Testing

The paper examines the problem of legitimation of the privatization’s outcomes in Russia and provides a critical appraisal of various political proposals for its resolution. The analysis proceeds from a distinction between two different types of ownership illegitimacy: "definite" and "vague" ones. The paper argues that the "vague" illegitimacy that has evolved in Russia is not an absolute obstacle for economic growth but rather an institutional birth trauma which is common for all post-socialist countries and which could be cured only by piecemeal approaching of relationships between "strong" and "weak" economic actors to principles of fair play.

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Marx and the “law of value”: Critical appraisal on the occasion of his 200th birth anniversary

Voprosy Ekonomiki ◽

10.32609/0042-8736-2018-11-27-49 ◽

2018 ◽

pp. 27-49 ◽

Cited By ~ 1

Author(s):

H. D. Kurz

Keyword(s):

Karl Marx ◽

Critical Appraisal ◽

Critical Discussion ◽

Use Value ◽

Transformation Problem ◽

The Common ◽

The Law

The paper celebrates Karl Marx’ 200th birthday in terms of a critical discussion of the “law of value” and the idea that “abstract labour”, and not any use value, is the common third of any two commodities that exchange for one another in a given proportion. It is argued that this view is difficult to sustain. It is also the source of the wretched and unnecessary “transformation problem”. Ironically, as Piero Sraffa has shown, prices of production and the general rate of profits are fully determined in terms of the same set of data from which Marx started his analysis.

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Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

MRS Proceedings ◽

10.1557/proc-473-63 ◽

1997 ◽

Vol 473 ◽

Author(s):

H. S. Yang ◽

F. R. Brotzen ◽

D. L. Callahan ◽

C. F. Dunn

Keyword(s):

Thin Film ◽

Electron Microscopy ◽

Scanning Electron Microscopy ◽

Distribution Function ◽

Quantitative Measurement ◽

Multilayer Films ◽

Adhesion Testing ◽

Novel Technique ◽

Electrostatic Adhesion ◽

Scanning Electron

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

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