The Validity of the Drift-Diffusion Equation in Small Semiconductor Devices

Author(s):  
J. B. Socha ◽  
F. A. Buot ◽  
J. A. Krumhansl
2016 ◽  
Vol 17 (12) ◽  
pp. 3473-3498 ◽  
Author(s):  
Rafael Granero-Belinchón

2005 ◽  
Vol 204 (2) ◽  
pp. 533-561 ◽  
Author(s):  
Carlo de Falco ◽  
Emilio Gatti ◽  
Andrea L. Lacaita ◽  
Riccardo Sacco

VLSI Design ◽  
1998 ◽  
Vol 8 (1-4) ◽  
pp. 539-544
Author(s):  
K. Banoo ◽  
F. Assad ◽  
M. S. Lundstrom

We present a multi-mode drift-diffusion equation as reformulation of the Boltzmann equation in the discrete momentum space. This is shown to be similar to the conventional drift-diffusion equation except that it is a more rigorous solution to the Boltzmann equation because the current and carrier densities are resolved into M×1 vectors, where M is the number of modes in the discrete momentum space. The mobility and diffusion coefficient become M×M matrices which connect the M momentum space modes. This approach is demonstrated by simulating electron transport in bulk silicon.


VLSI Design ◽  
1995 ◽  
Vol 3 (2) ◽  
pp. 211-224 ◽  
Author(s):  
Edwin C. Kan ◽  
Zhiping Yu ◽  
Robert W. Dutton ◽  
Datong Chen ◽  
Umberto Ravaioli

According to different assumptions in deriving carrier and energy flux equations, macroscopic semiconductor transport models from the moments of the Boltzmann transport equation (BTE) can be divided into two main categories: the hydrodynamic (HD) model which basically follows Bløtekjer's approach [1, 2], and the Energy Transport (ET) model which originates from Strattton's approximation [3, 4]. The formulation, discretization, parametrization and numerical properties of the HD and ET models are carefully examined and compared. The well-known spurious velocity spike of the HD model in simple nin structures can then be understood from its formulation and parametrization of the thermoelectric current components. Recent progress in treating negative differential resistances with the ET model and extending the model to thermoelectric simulation is summarized. Finally, we propose a new model denoted by DUET (Dual ET)which accounts for all thermoelectric effects in most modern devices and demonstrates very good numerical properties. The new advances in applicability and computational efficiency of the ET model, as well as its easy implementation by modifying the conventional drift-diffusion (DD) model, indicate its attractiveness for numerical simulation of advanced semiconductor devices


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