Surface and Thin Film Analysis of Metals and Semiconductors Using X-Ray Photoelectron Spectroscopy

1992 ◽  
pp. 883-897 ◽  
Author(s):  
S. Hofmann
1991 ◽  
Vol 35 (B) ◽  
pp. 883-897
Author(s):  
S. Hofmann

AbstractX-ray excited Photoelectron Spectroscopy (XPS) has become an indispensable tool for the study of metals and semiconductors. Due to the small mean free path of the photoelectrons In solids of the order of a few nanometers for energies in the keV range, it is a surface analysis technique. Its capability of quantitative analysis of all elements except hydrogen and helium and their chemical bonding states has recently been combined with small area and imaging analysis to typical spatial resolutions of about 10 μm. After a brief survey of the basic capabilities and limitations of XPS, some illustrative examples in typical metals and semiconductor research areas are presented, such as surface contamination and failure analysis in microelectronics, oxidation and corrosion, segregation at surfaces and interfaces, oxide/metal and oxide/semiconductor interfaces, and thin film analysis using angle resolved XPS and sputter depth profiling. Recent developments emphasize improved data evaluation and quantification schemes as well as instrumental capabilities with respect to both high spatial and energy resolution, and high power excitation sources such as synchrotron radiation.


Author(s):  
D.K. Ross ◽  
R.V. Heyman ◽  
D. Elthon

Until quite recently, electron microprobe analysis techniques were limited to samples of “infinite” thickness, that is, to samples thick enough such that the entire excitation volume was contained within the material of interest. Thin film analysis was not possible with available matrix correction programs, which were based on the assumption of samples of “infinite” thickness. Now however, algorithms are available that permit analysis of thin samples.We have obtained one of the more versatile and sophisticated of these programs. In order to investigate the accuracy of this routine we have analyzed several BiSrCaCuO thin films at 15 kV and repeated the analysis at 30 kV. These films were thick enough such that at 15 kV conventional ZAF data reduction yielded acceptable totals (98-101 %) with minimal substrate x rays observed. At 30 kV, however abundant substrate x rays were observed and ZAF yielded very low totals. X-ray intensity ratios from 30 kV runs were used to estimate film thickness and matrix corrections were applied using the Waldo algorithm.


1993 ◽  
Vol 20 (2) ◽  
pp. 111-114 ◽  
Author(s):  
Richard A. Waldo ◽  
Maria C. Militello ◽  
Stephen W. Gaarenstroom

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