Cyclic Heat Flow Meter Apparatus to Measure Thermal Contact Resistance, Conductivity and Diffusivity

1978 ◽  
pp. 169-176 ◽  
Author(s):  
C. J. Shirtliffe ◽  
D. G. Stephenson ◽  
W. C. Brown
2007 ◽  
Vol 99 (1) ◽  
pp. 304-310 ◽  
Author(s):  
Thomas J. Sauer ◽  
Tyson E. Ochsner ◽  
Robert Horton

2021 ◽  
Vol 11 (3) ◽  
pp. 979
Author(s):  
Katia Gaspar ◽  
Miquel Casals ◽  
Marta Gangolells

Accurate information on the actual thermal transmittance of walls is vital to select appropriate energy-saving measures in existing buildings to meet the commitments of the European Green Deal. To obtain accurate results using the heat flow meter (HFM) method, good thermal contact must be made between the heat flow meter plate and the wall surface. This paper aimed to assess the influence of the non-perfect thermal contact of heat flow meter plates on the accuracy of in situ measurement of the façades’ U-value when a film was applied to avoid damage to the wall surface. Given the fact that to avoid harm to the wall surface, the laying of a film is a usual procedure in the installation of equipment during the building’s operational stage. The findings show that deviations between measured U-values when an HFM was installed directly on the wall surface and when an HFM was installed with a PVC film were found to differ significantly from the theoretical effect of including a PVC film during the monitoring process.


1999 ◽  
Vol 122 (1) ◽  
pp. 46-49 ◽  
Author(s):  
Y. Z. Li ◽  
C. V. Madhusudana ◽  
E. Leonardi

A resistance to heat flow exists at the junction of two surfaces. It has long been recognized that there exists a hysteresis effect, that is, the value of thermal contact resistance in the unloading process is less than that in the loading process at the same load. However, little work has been done in utilizing this phenomenon to enhance the thermal contact conductance. The present experimental work investigated the effect of loading history; in particular the number of load cycles and overloading pressure, on the thermal contact conductance. It was found that the value of the thermal contact conductance might be enhanced by up to 51 percent. A cost-effective way of enhancing the contact conductance is suggested. [S0022-1481(00)01601-7]


2020 ◽  
Vol 27 (7) ◽  
pp. 617-627
Author(s):  
Yuanyuan Tian ◽  
Mengjun Zhang ◽  
Junli Wang ◽  
Anbang Liu ◽  
Huaqing Xie ◽  
...  

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