Influence of Silicon Phase Particles on the Thermal Conductivity of Al-Si Alloys

2019 ◽  
pp. 193-198 ◽  
Author(s):  
Wenping Weng ◽  
Hiromi Nagaumi ◽  
Xiaodong Sheng ◽  
Weizhong Fan ◽  
Xiaocun Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Phase

Microstructure evolution, thermal conductivity and mechanical properties of hot-rolling Al–Si–Fe–Mg alloy under different reductions

2021 ◽  
Author(s):  
Yu Guo ◽  
Ye Wang ◽  
Bo Jiang ◽  
Hongtao Chen ◽  
Hongyu Xu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Hot Rolling ◽  
Eutectic Silicon ◽  
Mg Alloy ◽  
Free Electrons ◽  
Silicon Phase ◽  
Transport Channel ◽  
Overall Performance ◽  
Average Size

To further improve the properties of the Al–11.5Si–0.4Fe–0.35Mg, the effects of different reductions of hot-rolling (HR) Al–Si–Fe–Mg alloy on microstructure, thermal conductivity (TC), and mechanical properties were investigated in this paper. The results show that the eutectic silicon phases are broken and moved during the HR process. The average size of eutectic silicon phase decreases. Meanwhile, the aspect ratio of eutectic silicon phase closer to 1 and the distribution of that are more uniform with the increase of HR reduction. In addition, the ternary Al–Fe–Si phases are also broken after HR. It indicates that the action of shear force induced by the HR process is beneficial to promote refinement and spheroidization of the eutectic silicon phase, hence further improves the properties of the alloy. Apparently, the fine and dispersed distribution of spherical silicon particles can minimize the splitting of the [Formula: see text]-Al matrix, decrease the scattering effect on free electrons, and increase the number of free-electron transport channel. Therefore, the overall performance of HR Al–Si–Fe–Mg alloy with a reduction of 71.25% is the best with the TC of 170.24 W/m[Formula: see text]K, the tensile strength of 241.98 MPa and elongation of 8.73%, respectively.

Liquid-exchange processing and properties of SiC–Al composites

1997 ◽  
Vol 12 (7) ◽  
pp. 1785-1789 ◽  
Author(s):  
Leszek Hozer ◽  
Yet-Ming Chiang ◽  
Svetlana Ivanova ◽  
Isa Bar-On
Keyword(s):  
Thermal Conductivity ◽  
Fracture Toughness ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Exchange Process ◽  
Secondary Phase ◽  
Single Edge ◽  
Silicon Phase ◽  
Silicon Carbides ◽  
Beam Technique

In this paper we demonstrate a novel liquid-exchange process to replace a secondary silicon phase in reaction-bonded siliconized silicon carbides (RBSC's) with a ductile metal reinforcement phase. When RBSC is exchanged with pure Al or Al–Si liquid, secondary phase silicon is dissolved and is substituted by Al or Al–Si alloy. The resulting composites show improvements in fracture toughness (single-edge precracked beam technique), with KIC value up to 8.6 Mpa · m1/2, compared to 3–4 MPa · m1/2 in otherwise similar siliconized silicon carbide. Increased fracture strength (four point flexure) was also observed after the liquid exchange process. The processing furthermore allows the coefficient of thermal expansion to be adjusted, and the thermal conductivity increased, for electronic packaging applications.

HARDNESS AND THERMAL CONDUCTIVITY OF As-Se-Te CHALCOGENIDE GLASSES

1981 ◽  
Vol 42 (C4) ◽  
pp. C4-931-C4-934 ◽  
Author(s):  
M. F. Kotkata ◽  
M.B. El-den
Keyword(s):  
Thermal Conductivity ◽  
Chalcogenide Glasses

A STUDY OF THE Pb PRECIPITATION IN NaCl FROM THERMAL CONDUCTIVITY EXPERIMENTS

1981 ◽  
Vol 42 (C6) ◽  
pp. C6-893-C6-895
Author(s):  
M. Locatelli ◽  
R. Suchail ◽  
E. Zecchi
Keyword(s):  
Thermal Conductivity

THEORY OF THERMAL CONDUCTIVITY IN MOLECULAR CRYSTALS, APPLICATION TO ALCALI CYANIDES

1981 ◽  
Vol 42 (C6) ◽  
pp. C6-247-C6-249 ◽  
Author(s):  
W. Bauernfeind ◽  
J. Keller ◽  
U. Schröder
Keyword(s):  
Thermal Conductivity ◽  
Molecular Crystals
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