Serial Interface Converter of Micromechanical Sensors to a Parallel Interface

Author(s):  
Eugene V. Larkin ◽  
Maxim A. Antonov
2021 ◽  
Author(s):  
A. Suresh ◽  
S. Shyama ◽  
Sangeeta Srivastava ◽  
Nihar Ranjan

Sensing of analogue signals such as voltage, temperature, pressure, current etc. is required to acquire the real time analog signals in the form digital streams. Most of the static analog signals are converted into voltage using sensors, transducers etc. and then measured using ADCs. The digitized samples from ADC are collected either through serial or parallel interface and processed by the programmable chips such as processors, controllers, FPGAs, SOCs etc. In some cases, Multichannel supported ADCs are used to save the layout area when the functionalities are to be realized in a small form factor. In such scenarios, parallel interface for each channel is not a preferred interface considering the more number of interfaces / traces between the components. Hence, Custom, Sink synchronized, Configurable multichannel ADC soft IP core has been developed using VHDL coding to interwork with multichannel supported, time division multiplexed ADCs with serial interface. The developed IP core can be used either as it is with the SPI interface as specified in this paper or with necessary modifications / configurations. The configurations can be the number of channels, sample size, sampling frequency, data transfer clock, type of synchronization – source / sink, control signals and the sequence of the operations performed to configure ADC. The efficiency of implementation is validated using the measurements of throughput, and accuracy for the required range of input with acceptable tolerances. ZYNQ FPGA and LTC2358 ADC are used to evaluate the developed IP core. Integrated Logic Analyser (ILA) which is an integrated verification tool of Vivado is used for Verification.


Author(s):  
Alan Kennen ◽  
John F. Guravage ◽  
Lauren Foster ◽  
John Kornblum

Abstract Rapidly changing technology highlights the necessity of developing new failure analysis methodologies. This paper will discuss the combination of two techniques, Design for Test (DFT) and Focused Ion Beam (FIB) analysis, as a means for successfully isolating and identifying a series of high impedance failure sites in a 0.35 μm CMOS design. Although DFT was designed for production testing, the failure mechanism discussed in this paper may not have been isolated without this technique. The device of interest is a mixed signal integrated circuit that provides a digital up-convert function and quadrature modulation. The majority of the circuit functions are digital and as such the majority of the die area is digital. For this analysis, Built In Self Test (BIST) circuitry, an evaluation board for bench testing and FIB techniques were used to successfully identify an unusual failure mechanism. Samples were subjected to Highly Accelerated Stress Test (HAST) as part of the device qualification effort. Post-HAST electrical testing at 200MHz indicated that two units were non-functional. Several different functional blocks on the chip failed electrical testing. One part of the circuitry that failed was the serial interface. The failure analysis team decided to look at the serial interface failure mode first because of the simplicity of the test. After thorough analysis the FA team discovered increasing the data setup time at the serial port input allowed the device to work properly. SEM and FIB techniques were performed which identified a high impedance connection between a metal layer and the underlying via layer. The circuit was modified using a FIB edit, after which all vectors were read back correctly, without the additional set-up time.


1995 ◽  
Vol 51 (1) ◽  
pp. 9-12 ◽  
Author(s):  
M.S. Benrakkad ◽  
J.M. Lopez-Villegas ◽  
J. Samitier ◽  
J.R. Morante ◽  
M. Kirsten ◽  
...  

1984 ◽  
Author(s):  
Haw-Ming Haung ◽  
D. Banatao ◽  
G. Perlegos ◽  
Tsing-Ching Wu ◽  
Te-Long Chiu

Author(s):  
Frank O'Mahony ◽  
Joseph Kennedy ◽  
James E. Jaussi ◽  
Ganesh Balamurugan ◽  
Mozhgan Mansuri ◽  
...  
Keyword(s):  

Author(s):  
Timothy O. Dickson ◽  
Yong Liu ◽  
Ankur Agrawal ◽  
John F. Bulzacchelli ◽  
Herschel Ainspan ◽  
...  
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