Electrically Impermeable Interface Cracks in Piezoelectric Materials

Author(s):  
Volodymyr Govorukha ◽  
Marc Kamlah ◽  
Volodymyr Loboda ◽  
Yuri Lapusta
2016 ◽  
Vol 25 (2) ◽  
pp. 023001 ◽  
Author(s):  
V Govorukha ◽  
M Kamlah ◽  
V Loboda ◽  
Y Lapusta

2004 ◽  
Vol 41 (2) ◽  
pp. 323-335 ◽  
Author(s):  
Cun-Fa Gao ◽  
Christoph Häusler ◽  
Herbert Balke

1996 ◽  
Vol 23 (6) ◽  
pp. 615-620 ◽  
Author(s):  
Shun Diao ◽  
Qing Hua Qin ◽  
Jianling Dong

2004 ◽  
Vol 261-263 ◽  
pp. 477-482 ◽  
Author(s):  
Wen Jie Feng ◽  
Zhi Wen Zou ◽  
R.K.L. Su ◽  
Z.Z. Zou

The linear piezoelectricity theory is applied to investigate the dynamic response of coplanar interface cracks between two dissimilar piezoelectric materials subjected to the mechanical and electrical impacts. The number of cracks is arbitrary, and the interface cracks are assumed to be permeable for electric field. Integral transforms and dislocation density function are employed to reduce the problem to Cauchy singular integral equations. Numerical examples are given to show the effects of crack relative position and material property parameters on the variations of dynamic energy release rate.


Author(s):  
T. A. Emma ◽  
M. P. Singh

Optical quality zinc oxide films have been characterized using reflection electron diffraction (RED), replication electron microscopy (REM), scanning electron microscopy (SEM), and X-ray diffraction (XRD). Significant microstructural differences were observed between rf sputtered films and planar magnetron rf sputtered films. Piezoelectric materials have been attractive for applications to integrated optics since they provide an active medium for signal processing. Among the desirable physical characteristics of sputtered ZnO films used for this and related applications are a highly preferred crystallographic texture and relatively smooth surfaces. It has been found that these characteristics are very sensitive to the type and condition of the substrate and to the several sputtering parameters: target, rf power, gas composition and substrate temperature.


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