In this paper, a novel integrated measuring and control system for hot box experiments is presented. The system, based on a general-purpose microcontroller and on a wireless sensors network, is able to fully control the thermal phenomena inside the chambers, as well as the heat flux that involves the specimen wall. Thanks to the continuous measurements of air and surfaces temperatures and energy input into the hot chamber, the thermal behavior of each hot box component is analyzed. A specific algorithm allows the post-process of the measured data for evaluating the specimen wall thermal quantities and for creating 2D and 3D thermal models of each component. The system reliability is tested on a real case represented by a double insulating X-lam wall. The results of the 72 h experiment show the system’s capability to maintain stable temperature set points inside the chambers and to log the temperatures measured by the 135 probes, allowing to know both the U-value of the sample (equal to 0.216 ± 0.01 W/m2K) and the thermal models of all the hot box components. The U-value obtained via hot box method has been compared with the values gathered through theoretical calculation and heat flow meter measurements, showing differences of less than 20%. Finally, thanks to the data postprocessing, the 2D and 3D thermal models of the specimen wall and of the chambers have been recreated.
Integrated Measuring and Control System for Thermal Analysis of Buildings Components in Hot Box Experiments