Electrical Modeling of a Through Silicon Via

2014 ◽  
pp. 23-60 ◽  
Author(s):  
Joohee Kim ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Through Silicon Via ◽  
Electrical Modeling

scholarly journals Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

2010 ◽  
Vol 57 (1) ◽  
pp. 256-262 ◽  
Author(s):  
Guruprasad Katti ◽  
Michele Stucchi ◽  
Kristin De Meyer ◽  
Wim Dehaene
Keyword(s):  
Three Dimensional ◽  
Through Silicon Via ◽  
Electrical Modeling

Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array

2017 ◽  
Vol 27 (7) ◽  
pp. 618-620 ◽  
Author(s):  
Xiaoxian Liu ◽  
Zhangming Zhu ◽  
Yintang Yang ◽  
Ruixue Ding ◽  
Yuejin Li
Keyword(s):  
Through Silicon Via ◽  
Modeling And Analysis ◽  
Electrical Modeling ◽  
Dielectric Cavity

Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via

2011 ◽  
Vol 59 (6) ◽  
pp. 1454-1460 ◽  
Author(s):  
En-Xiao Liu ◽  
Er-Ping Li ◽  
Wei-Bin Ewe ◽  
Hui Min Lee ◽  
Teck Guan Lim ◽  
...  
Keyword(s):  
Equivalent Circuit ◽  
Equivalent Circuit Model ◽  
Circuit Model ◽  
Through Silicon Via ◽  
Electrical Modeling

Front End of Line Through Silicon Via (TSV) Integration

2008 ◽  
Author(s):  
Subhash L. Shinde ◽  
Todd M. Bauer ◽  
Jordan E. Massad ◽  
Dale L. Hetherington
Keyword(s):  
Through Silicon Via ◽  
Front End

A Region-Based Through-Silicon via Repair Method for Clustered Faults

2017 ◽  
Vol E100.C (12) ◽  
pp. 1108-1117 ◽  
Author(s):  
Tianming NI ◽  
Huaguo LIANG ◽  
Mu NIE ◽  
Xiumin XU ◽  
Aibin YAN ◽  
...  
Keyword(s):  
Through Silicon Via ◽  
Repair Method

3D system-on-a-chip design with through-silicon-via-less power supply using highly doped silicon via

2020 ◽  
Vol 59 (SG) ◽  
pp. SGGL04
Author(s):  
Kota Shiba ◽  
Mototsugu Hamada ◽  
Tadahiro Kuroda
Keyword(s):  
Power Supply ◽  
Chip Design ◽  
Through Silicon Via ◽  
Doped Silicon ◽  
System On A Chip
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