Electrical Design of Through Silicon Via
Latest Publications

TOTAL DOCUMENTS

7
(FIVE YEARS 0)

H-INDEX

1
(FIVE YEARS 0)

Published By Springer Netherlands

9789401790376, 9789401790383
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Noise Coupling and Shielding in 3D ICs

2014 ◽  
pp. 115-146
Author(s):  
Jonghyun Cho ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Noise Coupling ◽  
3D Ics

Thermal Effects on TSV Signal Integrity

2014 ◽  
pp. 147-172
Author(s):  
Manho Lee ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Thermal Effects ◽  
Signal Integrity

Electrical Modeling of a Through Silicon Via

2014 ◽  
pp. 23-60 ◽  
Author(s):  
Joohee Kim ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Through Silicon Via ◽  
Electrical Modeling

Introduction

2014 ◽  
pp. 1-21
Author(s):  
Jun So Pak ◽  
Joungho Kim

High-Speed TSV-Based Channel Modeling and Design

2014 ◽  
pp. 61-114
Author(s):  
Heegon Kim ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
High Speed ◽  
Channel Modeling

TSV Decoupling Schemes

2014 ◽  
pp. 225-272
Author(s):  
Eunseok Song ◽  
Jun So Pak ◽  
Joungho Kim
Load More ...
Sign in / Sign up

Export Citation Format

Share Document