Noise Coupling and Shielding in 3D ICs

2014 ◽  
pp. 115-146
Author(s):  
Jonghyun Cho ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Noise Coupling ◽  
3D Ics

Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs

Integration ◽  
2014 ◽  
Vol 47 (3) ◽  
pp. 296-306 ◽  
Author(s):  
Hailang Wang ◽  
Mohammad H. Asgari ◽  
Emre Salman
Keyword(s):  
Compact Model ◽  
Noise Coupling ◽  
3D Ics

MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs

2020 ◽  
Vol 19 (2) ◽  
pp. 543-554
Author(s):  
Weijun Zhu ◽  
Yang Wang ◽  
Gang Dong ◽  
Yintang Yang ◽  
Yuejin Li ◽  
...  
Keyword(s):  
Power Delivery ◽  
Modeling And Analysis ◽  
Noise Coupling ◽  
3D Ics ◽  
Power Delivery Network ◽  
Delivery Network

scholarly journals Modeling and optimization of noise coupling in TSV-based 3D ICs

2014 ◽  
Vol 11 (20) ◽  
pp. 20140797-20140797 ◽  
Author(s):  
Yingbo Zhao ◽  
Yintang Yang ◽  
Gang Dong
Keyword(s):  
Modeling And Optimization ◽  
Noise Coupling ◽  
3D Ics

Coupling Capacitance Extraction between TSVs in 3D ICs Using Inverse of Inductance Matrix

2015 ◽  
Vol 135 (7) ◽  
pp. 744-751
Author(s):  
Tetsuya Kobayashi ◽  
Nanako Niioka ◽  
Masa-aki Fukase ◽  
Atsushi Kurokawa
Keyword(s):  
Capacitance Extraction ◽  
Coupling Capacitance ◽  
3D Ics

Chip Level Simulation of Substrate Noise Coupling and Interference in RF ICs with CMOS Digital Noise Emulator

2014 ◽  
Vol E97.C (6) ◽  
pp. 546-556
Author(s):  
Naoya AZUMA ◽  
Shunsuke SHIMAZAKI ◽  
Noriyuki MIURA ◽  
Makoto NAGATA ◽  
Tomomitsu KITAMURA ◽  
...  
Keyword(s):  
Substrate Noise ◽  
Noise Coupling ◽  
Substrate Noise Coupling ◽  
Rf Ics
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