Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs

Hailang Wang; Mohammad H. Asgari; Emre Salman

doi:10.1016/j.vlsi.2013.10.006

Compact model to efficiently characterize TSV-to-transistor noise coupling in 3D ICs

Integration ◽

10.1016/j.vlsi.2013.10.006 ◽

2014 ◽

Vol 47 (3) ◽

pp. 296-306 ◽

Cited By ~ 7

Author(s):

Hailang Wang ◽

Mohammad H. Asgari ◽

Emre Salman

Keyword(s):

Compact Model ◽

Noise Coupling ◽

3D Ics

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Noise Coupling and Shielding in 3D ICs

Electrical Design of Through Silicon Via ◽

10.1007/978-94-017-9038-3_4 ◽

2014 ◽

pp. 115-146

Author(s):

Jonghyun Cho ◽

Jun So Pak ◽

Joungho Kim

Keyword(s):

Noise Coupling ◽

3D Ics

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Modeling, measurement and mitigation of crosstalk noise coupling in 3D-ICs

2008 IEEE Custom Integrated Circuits Conference ◽

10.1109/cicc.2008.4672178 ◽

2008 ◽

Author(s):

Liuchun Cai ◽

Ramesh Harjani

Keyword(s):

Crosstalk Noise ◽

Noise Coupling ◽

3D Ics

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Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning

2016 IEEE MTT-S International Microwave Symposium (IMS) ◽

10.1109/mwsym.2016.7540397 ◽

2016 ◽

Cited By ~ 1

Author(s):

X. Sun ◽

M. Rack ◽

G. Van der Plas ◽

M. Stucchi ◽

J. De Vos ◽

...

Keyword(s):

Circuit Model ◽

Si Substrate ◽

Substrate Effects ◽

Noise Coupling ◽

3D Ics ◽

Wafer Thinning

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MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs

Journal of Computational Electronics ◽

10.1007/s10825-020-01466-w ◽

2020 ◽

Vol 19 (2) ◽

pp. 543-554

Author(s):

Weijun Zhu ◽

Yang Wang ◽

Gang Dong ◽

Yintang Yang ◽

Yuejin Li ◽

...

Keyword(s):

Power Delivery ◽

Modeling And Analysis ◽

Noise Coupling ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Modeling and optimization of noise coupling in TSV-based 3D ICs

IEICE Electronics Express ◽

10.1587/elex.11.20140797 ◽

2014 ◽

Vol 11 (20) ◽

pp. 20140797-20140797 ◽

Cited By ~ 1

Author(s):

Yingbo Zhao ◽

Yintang Yang ◽

Gang Dong

Keyword(s):

Modeling And Optimization ◽

Noise Coupling ◽

3D Ics

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Analysis of TSV-Induced Mechanical Stress and Electrical Noise Coupling in Sub 5-nm Node Nanosheet FETs for Heterogeneous 3D-ICs

IEEE Access ◽

10.1109/access.2021.3053572 ◽

2021 ◽

Vol 9 ◽

pp. 16728-16735

Author(s):

Jinsu Jeong ◽

Jun-Sik Yoon ◽

Rock-Hyun Baek

Keyword(s):

Mechanical Stress ◽

Electrical Noise ◽

Noise Coupling ◽

3D Ics

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Synthesized compact model and experimental results for substrate noise coupling in lightly doped processes

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005. ◽

10.1109/cicc.2005.1568708 ◽

2006 ◽

Cited By ~ 4

Author(s):

Hai Lan ◽

Tze Wee Chen ◽

Chi On Chui ◽

P. Nikaeen ◽

Jae Wook Kim ◽

...

Keyword(s):

Experimental Results ◽

Compact Model ◽

Substrate Noise ◽

Noise Coupling ◽

Substrate Noise Coupling

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Efficient characterization of TSV-to-transistor noise coupling in 3D ICs

Proceedings of the 23rd ACM international conference on Great lakes symposium on VLSI - GLSVLSI '13 ◽

10.1145/2483028.2483064 ◽

2013 ◽

Cited By ~ 4

Author(s):

Hailang Wang ◽

Mohammad H. Asgari ◽

Emre Salman

Keyword(s):

Noise Coupling ◽

3D Ics

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Coupling Capacitance Extraction between TSVs in 3D ICs Using Inverse of Inductance Matrix

IEEJ Transactions on Electronics Information and Systems ◽

10.1541/ieejeiss.135.744 ◽

2015 ◽

Vol 135 (7) ◽

pp. 744-751

Author(s):

Tetsuya Kobayashi ◽

Nanako Niioka ◽

Masa-aki Fukase ◽

Atsushi Kurokawa

Keyword(s):

Capacitance Extraction ◽

Coupling Capacitance ◽

3D Ics

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Exhaustive and Systematic Accuracy Verification and Enhancement of STI Stress Compact Model for General Realistic Layout Patterns

IEICE Transactions on Electronics ◽

10.1587/transele.e93.c.1349 ◽

2010 ◽

Vol E93-C (8) ◽

pp. 1349-1358

Author(s):

Kenta YAMADA ◽

Toshiyuki SYO ◽

Hisao YOSHIMURA ◽

Masaru ITO ◽

Tatsuya KUNIKIYO ◽

...

Keyword(s):

Compact Model

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