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MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs
Journal of Computational Electronics
◽
10.1007/s10825-020-01466-w
◽
2020
◽
Vol 19
(2)
◽
pp. 543-554
Author(s):
Weijun Zhu
◽
Yang Wang
◽
Gang Dong
◽
Yintang Yang
◽
Yuejin Li
◽
...
Keyword(s):
Power Delivery
◽
Modeling And Analysis
◽
Noise Coupling
◽
3D Ics
◽
Power Delivery Network
◽
Delivery Network
Download Full-text
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Design of a Reliable Power Delivery Network for Monolithic 3D ICs*
2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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10.23919/date48585.2020.9116570
◽
2020
◽
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◽
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Power-delivery network in 3D ICs: Monolithic 3D vs. Skybridge 3D CMOS
2017 IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH)
◽
10.1109/nanoarch.2017.8053736
◽
2017
◽
Author(s):
Jiajun Shi
◽
Mingyu Li
◽
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Power Delivery
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Optimization of Power Bumps and TSVs with Optimized Power Mesh Structure for Power Delivery Network in 3D-ICs
Journal of IKEEE
◽
10.7471/ikeee.2012.16.2.102
◽
2012
◽
Vol 16
(2)
◽
pp. 102-108
Author(s):
Byung-Gyu Ahn
◽
Jae-Hwan Kim
◽
Cheol-Jon Jang
◽
Jong-Wha Chong
Keyword(s):
Power Delivery
◽
Mesh Structure
◽
3D Ics
◽
Power Delivery Network
◽
Delivery Network
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Simulation, Modeling and Analysis of Dynamic Power Delivery Network and Its Impact on Jitter
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
◽
10.1109/ectc.2016.198
◽
2016
◽
Author(s):
Sheng-Feng Lee
◽
Chia-Yu Chan
◽
Shang-Pin Chen
Keyword(s):
Simulation Modeling
◽
Power Delivery
◽
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◽
Dynamic Power
◽
Power Delivery Network
◽
Delivery Network
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Modeling and Analysis a of On-Die Decoupling Capacitance in the Power Delivery Network of an Integrated Chip
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)
◽
10.1109/emcsi.2018.8495317
◽
2018
◽
Cited By ~ 1
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◽
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Full chip impact study of power delivery network designs in monolithic 3D ICs
2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
◽
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◽
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Power Delivery Network
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Scan chain and power delivery network synthesis for pre-bond test of 3D ICs
29th VLSI Test Symposium
◽
10.1109/vts.2011.5783750
◽
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◽
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Modeling and analysis of system stability in a distributed power delivery network with embedded digital linear regulators
Fifteenth International Symposium on Quality Electronic Design
◽
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◽
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◽
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◽
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◽
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◽
System Stability
◽
Distributed Power
◽
Modeling And Analysis
◽
Power Delivery Network
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◽
Distributed Power Delivery
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Frequency and time domain analysis of power delivery network for monolithic 3D ICs
2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)
◽
10.1109/islped.2017.8009180
◽
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◽
Cited By ~ 5
Author(s):
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◽
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◽
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◽
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◽
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◽
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Keyword(s):
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◽
Time Domain Analysis
◽
Domain Analysis
◽
Power Delivery
◽
3D Ics
◽
Power Delivery Network
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Time-Domain FPGA Power Delivery Network Characterization Methodology
2021 IEEE 29th Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM)
◽
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◽
Author(s):
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◽
Martin L. Voogel
◽
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◽
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Keyword(s):
Time Domain
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Power Delivery
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Power Delivery Network
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Network Characterization
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Delivery Network
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