Evaluation of thermal deformation model for BGA packages using moiré interferometry

2004 ◽  
Vol 18 (2) ◽  
pp. 230-239 ◽  
Author(s):  
Jinwon Joo ◽  
Seungmin Cho
Keyword(s):  
Thermal Deformation ◽  
Moiré Interferometry ◽  
Deformation Model ◽  
Moire Interferometry ◽  
Bga Packages

scholarly journals Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry.

2002 ◽  
Vol 5 (7) ◽  
pp. 654-659
Author(s):  
Yasuyuki MORITA ◽  
Kazuo ARAKAWA ◽  
Mitsugu TODO ◽  
Masayuki KANETO
Keyword(s):  
Thermal Deformation ◽  
Flip Chip ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry

612 Application of Moire Interferometry to Thermal Deformation of IC Packages

2000 ◽  
Vol 2000.53 (0) ◽  
pp. 187-188
Author(s):  
Kazuo ARAKAWA ◽  
Mitsugu TODO ◽  
Shinji YAMADA ◽  
Kiyoshi TAKAHASHI
Keyword(s):  
Thermal Deformation ◽  
Moiré Interferometry ◽  
Moire Interferometry

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

1998 ◽  
Vol 120 (2) ◽  
pp. 160-165 ◽  
Author(s):  
J. Zhu ◽  
D. Zou ◽  
S. Liu
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Real Time ◽  
Electronic Packaging ◽  
Thermal Deformation ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Plastic Package ◽  
Highly Nonlinear ◽  
Fringe Patterns

Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits uneven thermal deformation in the whole temperature range during thermal cycling. This behavior will affect the buildup of thermal strain/stress within the package, which may affect the reliability of the package. Therefore, a real-time method is needed to monitor the thermal deformation of packages during the thermal cycling. In this study, a real-time moire´ interferometry technique coupled with a thermal vacuum chamber is used to monitor the thermal deformation of a plastic package. A grating is transferred onto the cross section of the sample at room temperature. The fringe patterns are recorded by a CCD camera system and are compared with the displacement contours obtained by nonlinear finite element simulation. High temperature moire´ results up to 200°C are reported here. The comparison between the moire´ fringe patterns and finite element results shows a good agreement. The results also show that the real-time moire´ interferometry technique is an effective way to monitor the thermal deformation of electronic packaging and is a powerful validation method for finite element analysis.

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

2005 ◽  
Vol 127 (2) ◽  
pp. 86-90 ◽  
Author(s):  
Woon-Seong Kwon ◽  
Myung-Jin Yim ◽  
Kyung-Wook Paik ◽  
Suk-Jin Ham ◽  
Soon-Bok Lee
Keyword(s):  
Thermal Cycling ◽  
Thermal Deformation ◽  
Flip Chip ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Acoustic Microscopy ◽  
Moire Interferometry ◽  
Organic Substrates ◽  
Conductive Adhesives ◽  
Reliability Performance

One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling reliability. In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy investigation was performed for tested assemblies. To elucidate the effects of ACF material properties and DNP on the thermal cycling reliability of ACF assembly, Weibull analysis for the lifetime estimation of ACF joint was performed, and compared with thermal deformations of ACF flip chip assembly investigated by moire´ interferometry. Results indicate that the properties of ACF have a significant role in the thermal deformation and reliability performance during thermal cycling testing. Therefore, optimized ACF properties can enhance ACF package reliability during thermal cycling regime.

Thermal Deformation Measurement on Electronic Packaging by Moire Interferometry

2000 ◽  
Vol 2000 (0) ◽  
pp. 537-538
Author(s):  
Kazuo ARAKAWA ◽  
Mitsugu TODO ◽  
Shinji YAMADA ◽  
Yashuyuki MORITA ◽  
Kiyoshi TAKAHASHI
Keyword(s):  
Electronic Packaging ◽  
Thermal Deformation ◽  
Moiré Interferometry ◽  
Deformation Measurement ◽  
Moire Interferometry
Sign in / Sign up

Export Citation Format

Share Document