2005 International Symposium on Electronics Materials and Packaging
Latest Publications

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(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

1424401070

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of Au and Ni Layer Thicknesses on the Reliability of BGA Solder Joints

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598241 ◽

2006 ◽

Author(s):

M.O. Alam ◽

Y.C. Chan ◽

L. Rufer

Keyword(s):

Solder Joints

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SAW chemical sensors based on AlGaN/GaN piezoelectric material system: acoustic design and packaging considerations

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598262 ◽

2006 ◽

Cited By ~ 2

Author(s):

L. Rufer ◽

A. Torres ◽

S. Mir ◽

M.O. Alam ◽

T. Lalinsky ◽

...

Keyword(s):

Piezoelectric Material ◽

Chemical Sensors ◽

Material System ◽

Acoustic Design

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Effect of Frequency on Fatigue Crack Growth along Interface between Copper Film and Silicon Substrate

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598236 ◽

2006 ◽

Cited By ~ 1

Author(s):

D. van Truong ◽

H. Hirakata ◽

T. Kitamura

Keyword(s):

Fatigue Crack ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Silicon Substrate ◽

Copper Film

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Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598242 ◽

2006 ◽

Author(s):

Ho-Young Son ◽

Yong-Woon Yeo ◽

Gi-Jo Jung ◽

Jun-Kyu Lee ◽

Joon-Young Choi ◽

...

Keyword(s):

Flip Chip ◽

Fine Pitch

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Evaluation of Thermal Deformation Behavior in Electronic Package using UV moire interferometry

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598263 ◽

2006 ◽

Author(s):

Jin-Hyoung Park ◽

Soon-Bok Lee

Keyword(s):

Deformation Behavior ◽

Thermal Deformation ◽

Moiré Interferometry ◽

Moire Interferometry ◽

Electronic Package

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A Study of Hot Spot in Silicon Device for Stacked Die Packages

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598268 ◽

2006 ◽

Cited By ~ 1

Author(s):

J. Akiyama ◽

M. Naeshiro ◽

M. Amagai

Keyword(s):

Hot Spot ◽

Silicon Device

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Reliability Analysis of Embedded Chip Technique with Design of Experiment Methods

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598233 ◽

2006 ◽

Cited By ~ 2

Author(s):

Xiuzhen Lu ◽

Liu Chen ◽

Zhaonian Cheng ◽

J. Liu

Keyword(s):

Reliability Analysis ◽

Design Of Experiment ◽

Embedded Chip

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A Multifunctional Test Chip for Microelectronic Packaging and Its Application on RF Property Measurements

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598239 ◽

2006 ◽

Cited By ~ 2

Author(s):

Kun-Fu Tseng ◽

Y.-H. Hsion ◽

B.-J. Lwo ◽

Chin-Hsing Kao

Keyword(s):

Microelectronic Packaging ◽

Test Chip

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Stability of Ni>inf<3>/inf<P and its effect on the interfacial reaction between electroless Ni-P and molten tin

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598244 ◽

2006 ◽

Author(s):

K. Chen ◽

C. Liu ◽

D.C. Whalley ◽

D.A. Hutt

Keyword(s):

Interfacial Reaction ◽

Electroless Ni

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Simulation of Tensile Deformation Behavior of Polymer by Chain Network Model

2005 International Symposium on Electronics Materials and Packaging ◽

10.1109/emap.2005.1598252 ◽

2006 ◽

Cited By ~ 1

Author(s):

A. Shinozaki ◽

K. Kishimoto ◽

H. Inoue

Keyword(s):

Network Model ◽

Deformation Behavior ◽

Tensile Deformation ◽

Tensile Deformation Behavior

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2005 International Symposium on Electronics Materials and PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of Au and Ni Layer Thicknesses on the Reliability of BGA Solder Joints

SAW chemical sensors based on AlGaN/GaN piezoelectric material system: acoustic design and packaging considerations

Effect of Frequency on Fatigue Crack Growth along Interface between Copper Film and Silicon Substrate

Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications

Evaluation of Thermal Deformation Behavior in Electronic Package using UV moire interferometry

A Study of Hot Spot in Silicon Device for Stacked Die Packages

Reliability Analysis of Embedded Chip Technique with Design of Experiment Methods

A Multifunctional Test Chip for Microelectronic Packaging and Its Application on RF Property Measurements

Stability of Ni>inf<3>/inf<P and its effect on the interfacial reaction between electroless Ni-P and molten tin

Simulation of Tensile Deformation Behavior of Polymer by Chain Network Model

2005 International Symposium on Electronics Materials and Packaging
Latest Publications