Effect of double-excitation ultrasonic elliptical vibration turning trajectory on surface morphology

Author(s):  
Bingjun Huo ◽  
Bo Zhao ◽  
Long Yin ◽  
Xingchen Guo ◽  
Xiaobo Wang
Author(s):  
Ali H. Ammouri ◽  
Ramsey F. Hamade

Presented is the detailed design and implementation of a bi-directional ultrasonic elliptical vibration actuator (BUEVA) for micro machining. Removal of material occurs via a generated elliptical tool motion resembling a natural ‘spoon feeding’ action in contrast to in-plane, horizontal motion utilized by most existing setups. The motion is generated by two stacked ceramic multilayer actuator ring (SCMAR) piezo elements vibrating out of phase in the tool’s axial and transverse directions. The amplitude of vibration of the tool is controlled in order to vary the cutting depth according to the desired cutting parameters. To ensure precise tool positioning, the BUEVA actuator is fitted to a 3-axis precision machining center that provides the necessary tool path. The cutting forces and the resulting surface finish are both numerically modeled and then experimentally measured by a 3-axis mini dynamometer and a surface profilometer, respectively. Preliminary cutting results show good dimensional definition and surface integrity.


Ultrasonics ◽  
2021 ◽  
pp. 106662
Author(s):  
Wei Bai ◽  
Kai Wang ◽  
Dongxing Du ◽  
Jianguo Zhang ◽  
Wen Huang ◽  
...  

Author(s):  
Sen Yin ◽  
Zhigang Dong ◽  
Yan Bao ◽  
Renke Kang ◽  
Wenhao Du ◽  
...  

Abstract Ultrasonic elliptical vibration cutting (UEVC) technique, as an advanced cutting method, has been successfully applied to machine difficult-to-cut materials for the last decade. In this study, the mechanism of the elliptical vibration locus caused by the “asymmetric structure” of the horn was analyzed theoretically firstly, and the corresponding relationship between the degree of asymmetry and the elliptical vibration locus was determined based on finite element method (FEM). Then an efficient single-excitation UEVC device with “asymmetric structure” was developed and optimized. The resonant frequency of the device was 40.8 kHz, and the amplitude reached 12.4 µm, which effectively broke the limitation of cutting speed in UEVC. Finally, the UEVC device's performance was tested, and the advantages in improving the tungsten alloy surface quality and reducing diamond cutting tool wear validated the technical capability and principle of the proposed device.


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