Numerical Analysis in Ultrasonic Elliptical Vibration Cutting (UEVC) Combined With Electrical Discharge Cutting (EDC) For Ti6Al4V

This paper reports the numerical analysis results of ultrasonic elliptical vibration cutting (UEVC) combined with the electrical discharge cutting (EDC), called UEVC+EDC. UEVC delivers decreasing cutting forces, repressing side-burrs, and lowering tool wear. EDC is a cutting technique using a pulsed spark to remove material using thermal energy. Difficult-to-cut materials, such as Ti-6Al-4V, can be cut effectively by combining these two techniques. A numerical study was performed using ABAQUS finite element analysis (FEA) software by investigating the von Mises stress, cutting forces, and temperature. Numerical analysis was carried out by modifying the ultrasonic vibration frequency, distance of the discharge pulse, discharge voltage, and discharge pulse radius. UEVC+EDC was compared numerically and experimentally with regular cutting (NC) and UEVC in terms of cutting force and tool temperature. The results showed that the UEVC+EDC method could improve the cutting condition by reducing the cutting force and von Mises stress and increasing the tool temperature.

Adsorption evaluation of large-size HDEHP/SiO2-P adsorbent investigated by micro-PIXE analysis

The Zr and Mo removal from HLLW is the current issue for repeated usage of the CMPO/SiO2-P-packed column. The adsorbability of the 2-mm-sized HDEHP/SiO2-P adsorbent, which was prepared by fabricating a SiO2 particle from the vibration cutting method and adapting a new polymerization method, was evaluated by the batch-wise adsorption experiment. In spite of the impregnation ratio of the HDEHP extractant, the extraction of Zr and Mo ions from the simulated HLLW was achieved but lanthanide ions e.g., Nd and Gd were also extracted as a minor component. Such unusual adsorption behavior of lanthanide ions could be only provided by accurate, sensitive and reliable micro-PIXE analysis.

Effect of Cutting Parameters on Chips and Burrs Formation With Traditional Micromilling and Ultrasonic Vibration Assisted Micromilling

In the traditional micromilling(TMM) of Inconel718 alloy, due to the influence of material plasticity and size effect, relatively large burr will be produced. In order to solve the burr problem in micromilling, ultrasonic vibration in feed direction is applied to the workpiece to complete vibration cutting. Combined with trajectory simulation and cutting experiment, the burr formation mechanism of TMM and ultrasonic vibration assisted micromilling(UVAMM) was studied. The results show that when the ratio of amplitude(A) to feed per tooth(ƒz) is greater than 0.5, continuous cutting changes to intermittent cutting. Compared with TMM, UVAMM improves chip breaking ability, facilitates the propagation of burr crack and effectively inhibits the formation of burr. However, due to the influence of cutting edge radius, A/ƒz should be set larger. When the chip breaking condition is reached, the burr shape is usually tearing or flocculent. Under the conditions of low speed(n), large ƒz and large A, the burr suppression is more obvious.