scholarly journals Thermal network model and experimental validation for a motorized spindle including thermal–mechanical coupling effect

Author(s):  
Changjiang Zhou ◽  
Zefeng Qu ◽  
Bo Hu ◽  
Shengbo Li
2021 ◽  
Author(s):  
Changjiang Zhou ◽  
Zefeng Qu ◽  
Bo Hu ◽  
Shengbo Li

Abstract Thermal deformation caused by temperature rise have an influence on the dynamic performance of a motorized spindle. In turn, the change in the dynamic performance will affect the temperature rise and thermal deformation of the system. However, the latter was rarely focused on in the previous literature. Therefore, a thermal network model of motorized spindle is enhanced by considering the thermal–mechanical coupling effect. Then, an iterative method is presented to solve the coupled equations, and a temperature test rig of the motorized spindle is set up to verify the proposed model. The relative error between the predicted and experimental results at two test points decreases by 9.56% and 3.44% after considering the thermal–mechanical coupling effect. The comparison with the experimental results shows that the proposed model with thermal–mechanical coupling effect can obtain a more accurate temperature field than the previous model.


Energies ◽  
2019 ◽  
Vol 12 (7) ◽  
pp. 1319 ◽  
Author(s):  
Yao Chang ◽  
Wuhua Li ◽  
Haoze Luo ◽  
Xiangning He ◽  
Francesco Iannuzzo ◽  
...  

In this paper, the impact of a double-sided press-pack insulated-gate-bipolar-transistor (PP IGBT) cooling structure on its thermal impedance distribution is studied and explored. A matrix thermal impedance network model is built by considering the multi-chip thermal coupling effect for the collector side of the PP IGBT. Moreover, a verification has been made by comparing the proposed matrix thermal network model and the conventional lumped RC network model provided by the manufacturer. It is concluded that the collector side has lower thermal resistance and dissipates about 88% of the heat generated by the IGBT chips inside the module. Then, a modular-multilevel-converter high-voltage-direct-current (MMC-HVDC)-based type test setup composed of the press-pack IGBT stacks is established and the junction temperature is calculated with the proposed thermal model and verified by temperature measurements.


2020 ◽  
Vol 140 (9) ◽  
pp. 625-632
Author(s):  
Yoshiaki Taguchi ◽  
Satoshi Kadowaki ◽  
Gaku Yoshikawa ◽  
Kenji Hatakeda ◽  
Takashi Kaneko

2014 ◽  
Vol 697 ◽  
pp. 181-186
Author(s):  
Zi Lei Wang ◽  
Tian De Qiu

The piezoelectric field and structure field of piezoelectric resonator of ultrasonic motor are intercoupling. It is difficult to obtain the solution under some circumstances because of the complex stress boundary condition and the influence of coupling effect. An electro-mechanical coupling finite-element dynamic equation is established on the basis of the Hamilton’s Principle about piezoceramic and elastomer. The equation is decoupled through the shock excitation of the piezoelectric resonator and the piezoelectricity element and material provided by finite-element analysis. As a result, an admittance curve as well as the distribution status of the nodal DOF is obtained, which provides an effective method to solve electro-mechanical coupling problems.


Author(s):  
Songhan Zhao ◽  
Linlin Cai ◽  
Wangyong Chen ◽  
Yandong He ◽  
Gang Du

Sign in / Sign up

Export Citation Format

Share Document