Distribution of deep levels in Si:Au by spectral analysis of deep-level transient spectroscopy

1998 ◽  
Vol 66 (3) ◽  
pp. 323-325 ◽  
Author(s):  
J. Yoshino ◽  
Y. Okamoto ◽  
J. Morimoto ◽  
T. Miyakawa
Author(s):  
Manuel Fregolent ◽  
Matteo Buffolo ◽  
Carlo de Santi ◽  
Sho Hasegawa ◽  
Junta Matsumura ◽  
...  

2001 ◽  
Vol 82 (1-3) ◽  
pp. 91-94 ◽  
Author(s):  
P Muret ◽  
A Philippe ◽  
E Monroy ◽  
E Muñoz ◽  
B Beaumont ◽  
...  

1987 ◽  
Vol 26 (Part 1, No. 10) ◽  
pp. 1634-1640 ◽  
Author(s):  
Jun Morimoto ◽  
Michihiro Fudamoto ◽  
Kenichiro Tahira ◽  
Tatsuo Kida ◽  
Seiji Kato ◽  
...  

2010 ◽  
Vol 645-648 ◽  
pp. 759-762
Author(s):  
Koutarou Kawahara ◽  
Giovanni Alfieri ◽  
Michael Krieger ◽  
Tsunenobu Kimoto

In this study, deep levels are investigated, which are introduced by reactive ion etching (RIE) of n-type/p-type 4H-SiC. The capacitance of as-etched p-type SiC is remarkably small due to compensation or deactivation of acceptors. These acceptors can be recovered to the initial concentration of the as-grown sample after annealing at 1000oC. However, various kinds of defects remain at a total density of ~5× 1014 cm-3 in a surface-near region from 0.3 μm to 1.0 μm even after annealing at 1000oC. The following defects are detected by Deep Level Transient Spectroscopy (DLTS): IN2 (EC – 0.35 eV), EN (EC – 1.6 eV), IP1 (EV + 0.35 eV), IP2 (HS1: EV + 0.39 eV), IP4 (HK0: EV + 0.72 eV), IP5 (EV + 0.75 eV), IP7 (EV + 1.3 eV), and EP (EV + 1.4 eV). These defects generated by RIE can be significantly reduced by thermal oxidation and subsequent annealing at 1400oC.


1988 ◽  
Vol 27 (Part 1, No. 12) ◽  
pp. 2256-2259 ◽  
Author(s):  
Jun Morimoto ◽  
Michihiro Fudamoto ◽  
Shuuji Tashiro ◽  
Masaaki Arai ◽  
Toru Miyakawa ◽  
...  

2001 ◽  
Vol 90 (7) ◽  
pp. 3377-3382 ◽  
Author(s):  
A. Kawasuso ◽  
F. Redmann ◽  
R. Krause-Rehberg ◽  
T. Frank ◽  
M. Weidner ◽  
...  

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