Spatial and temporal characterization of trace elements and nutrients in the Rawal Lake Reservoir, Pakistan using multivariate analysis techniques

2011 ◽  
Vol 33 (6) ◽  
pp. 525-541 ◽  
Author(s):  
Riffat Naseem Malik ◽  
Muhammad Nadeem
Keyword(s):  
Trace Elements ◽  
Multivariate Analysis ◽  
Analysis Techniques

Use of multivariate analysis techniques for the characterization of analytical results for the determination of the mineral composition of kale

2010 ◽  
Vol 96 (2) ◽  
pp. 352-356 ◽  
Author(s):  
Joelma C. Fadigas ◽  
Ana M.P. dos Santos ◽  
Raildo M. de Jesus ◽  
Daniel C. Lima ◽  
Wallace D. Fragoso ◽  
...  
Keyword(s):  
Multivariate Analysis ◽  
Mineral Composition ◽  
Analysis Techniques ◽  
Analytical Results

scholarly journals Characterization of Bioactive Compounds in Northern Amazon Fruits

2019 ◽  
Vol 11 (9) ◽  
pp. 134
Author(s):  
Ismael Montero Fernández ◽  
Edvan Alves Chagas ◽  
Antonio Alves de Melo Filho ◽  
Selvin Antonio Saravia Maldonado ◽  
Ricardo Carvalho dos Santos ◽  
...  
Keyword(s):  
Multivariate Analysis ◽  
Vitamin C ◽  
Fruits And Vegetables ◽  
Reducing Sugars ◽  
Bioactive Molecules ◽  
Pharmacological Properties ◽  
Total Carotenoids ◽  
Analysis Techniques ◽  
Different Parts

Fruits and vegetables are highly appreciated because they are constituted by active phytochemicals with functional properties for the organism acting with modulating pharmacological effect. Given the pharmacological properties of this type of food, in this work were studied the concentrations of vitamin C, total carotenoids and reducing and non-reducing sugars of nine fruits developed in the northern Amazon region: Abiu, Acerola, Araçá, Bacuparí, Biribá, Camu-camu, Fruta-do-conde, Graviola and Tapereba. The concentration of vitamin C, the highest concentration in the shell of Camu-camu 2521.51 mg 100 g-1 and for acerola with 1731.4 mg 100 g-1 stand out. The highest concentrations of total carotenoids were also found for the Camu-camu, with concentrations of 0.67 mg 100 g-1 the shell of Camu-camu and 0.57 mg 100 g-1 for the pulp. The concentrations of sugars are higher for the pulps, with the highest concentrations for the pulp of the Fruta-do-conde with 16.31 g 100 g-1 followed by the pulp of the Graviola, both of the Annonaceae family with a concentration of 15.61 g 100 g-1. The different bioactive molecules were correlated for the different parts of the fruit, by means of multivariate analysis techniques (PCA and HCA), where 90.1% of the cases were explained for the pulps, 65.4% for the shell of the fruits and finally the 88.5% of the cases for the seeds. Given the results obtained in this work, these fruits can be used for the preparation of foods with functional interest.

Insulinomimetic properties of trace elements and characterization of their in vivo mode of action

Diabetes ◽  
1990 ◽  
Vol 39 (10) ◽  
pp. 1243-1250 ◽  
Author(s):  
L. Rossetti ◽  
A. Giaccari ◽  
E. Klein-Robbenhaar ◽  
L. R. Vogel
Keyword(s):  
Trace Elements ◽  
Mode Of Action

BUSINESS FAILURE PREDICTION USING ROUGH SETS: A COMPARISON WITH MULTIVARIATE ANALYSIS TECHNIQUES

1999 ◽  
Vol 04 (01) ◽  
Author(s):  
C. Zopounidis ◽  
M. Doumpos ◽  
R. Slowinski ◽  
R. Susmaga ◽  
A. I. Dimitras
Keyword(s):  
Multivariate Analysis ◽  
Rough Sets ◽  
Failure Prediction ◽  
Business Failure ◽  
Analysis Techniques

Failure Analysis of CDM-ESD Damage in a GaAs RFIC

2000 ◽  
Author(s):  
Amy Poe ◽  
Steve Brockett ◽  
Tony Rubalcava
Keyword(s):  
Radio Frequency ◽  
Failure Analysis ◽  
Integrated Circuit ◽  
Production Test ◽  
Analysis Techniques ◽  
Device Model ◽  
Charged Device ◽  
Subsequent Failure

Abstract The intent of this work is to demonstrate the importance of charged device model (CDM) ESD testing and characterization by presenting a case study of a situation in which CDM testing proved invaluable in establishing the reliability of a GaAs radio frequency integrated circuit (RFIC). The problem originated when a sample of passing devices was retested to the final production test. Nine of the 200 sampled devices failed the retest, thus placing the reliability of all of the devices in question. The subsequent failure analysis indicated that the devices failed due to a short on one of two capacitors, bringing into question the reliability of the dielectric. Previous ESD characterization of the part had shown that a certain resistor was likely to fail at thresholds well below the level at which any capacitors were damaged. This paper will discuss the failure analysis techniques which were used and the testing performed to verify the failures were actually due to ESD, and not caused by weak capacitors.

Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process

1996 ◽  
Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn
Keyword(s):  
Process Development ◽  
Process Integration ◽  
Wafer Level ◽  
Electrical Failure ◽  
Analysis Techniques ◽  
Integration Approach ◽  
Intermetal Dielectric ◽  
Metallization Process ◽  
Section Analysis

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.

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