Simulation and experimental determination of the macro-scale layer thickness distribution of electrodeposited Cu-line patterns on a wafer substrate
2005 ◽
Vol 35
(6)
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pp. 589-598
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2019 ◽
Vol 481
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pp. 1103-1108
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2009 ◽
Vol 51
(9)
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pp. 1929-1934
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2019 ◽
Vol 103
(1-4)
◽
pp. 985-995
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2009 ◽
Vol 19
(3)
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pp. 189-192
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Keyword(s):
1979 ◽
Vol 40
(C7)
◽
pp. C7-709-C7-710
Keyword(s):