Optimization of Power Bumps and TSVs with Optimized Power Mesh Structure for Power Delivery Network in 3D-ICs

Journal of IKEEE ◽

10.7471/ikeee.2012.16.2.102 ◽

2012 ◽

Vol 16 (2) ◽

pp. 102-108

Author(s):

Byung-Gyu Ahn ◽

Jae-Hwan Kim ◽

Cheol-Jon Jang ◽

Jong-Wha Chong

Keyword(s):

Power Delivery ◽

Mesh Structure ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Design of a Reliable Power Delivery Network for Monolithic 3D ICs*

2020 Design, Automation & Test in Europe Conference & Exhibition (DATE) ◽

10.23919/date48585.2020.9116570 ◽

2020 ◽

Author(s):

Shao-Chun Hung ◽

Krishnendu Chakrabarty

Keyword(s):

Power Delivery ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Power-delivery network in 3D ICs: Monolithic 3D vs. Skybridge 3D CMOS

2017 IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH) ◽

10.1109/nanoarch.2017.8053736 ◽

2017 ◽

Author(s):

Jiajun Shi ◽

Mingyu Li ◽

Csaba Andras Moritz

Keyword(s):

Power Delivery ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Full chip impact study of power delivery network designs in monolithic 3D ICs

2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) ◽

10.1109/iccad.2014.7001406 ◽

2014 ◽

Author(s):

Sandeep Kumar Samal ◽

Kambiz Samadi ◽

Pratyush Kamal ◽

Yang Du ◽

Sung Kyu Lim

Keyword(s):

Power Delivery ◽

Impact Study ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Scan chain and power delivery network synthesis for pre-bond test of 3D ICs

29th VLSI Test Symposium ◽

10.1109/vts.2011.5783750 ◽

2011 ◽

Author(s):

Shreepad Panth ◽

Sung Kyu Lim

Keyword(s):

Power Delivery ◽

Network Synthesis ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Power bumps and through‐silicon‐vias placement with optimised power mesh structure for power delivery network in three‐dimensional‐integrated circuits

IET Computers & Digital Techniques ◽

10.1049/iet-cdt.2012.0047 ◽

2013 ◽

Vol 7 (1) ◽

pp. 11-20 ◽

Author(s):

Cheoljon Jang ◽

Jaehwan Kim ◽

Byunggyu Ahn ◽

Jongwha Chong

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Power Delivery ◽

Through Silicon Vias ◽

Mesh Structure ◽

Power Delivery Network ◽

Silicon Vias ◽

Delivery Network

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MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs

Journal of Computational Electronics ◽

10.1007/s10825-020-01466-w ◽

2020 ◽

Vol 19 (2) ◽

pp. 543-554

Author(s):

Weijun Zhu ◽

Yang Wang ◽

Gang Dong ◽

Yintang Yang ◽

Yuejin Li ◽

...

Keyword(s):

Power Delivery ◽

Modeling And Analysis ◽

Noise Coupling ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Frequency and time domain analysis of power delivery network for monolithic 3D ICs

2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) ◽

10.1109/islped.2017.8009180 ◽

2017 ◽

Author(s):

Kyungwook Chang ◽

Shidhartha Das ◽

Saurabh Sinha ◽

Brian Cline ◽

Greg Yeric ◽

...

Keyword(s):

Time Domain ◽

Time Domain Analysis ◽

Domain Analysis ◽

Power Delivery ◽

3D Ics ◽

Power Delivery Network ◽

Delivery Network

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Time-Domain FPGA Power Delivery Network Characterization Methodology

2021 IEEE 29th Annual International Symposium on Field-Programmable Custom Computing Machines (FCCM) ◽

10.1109/fccm51124.2021.00064 ◽

2021 ◽

Author(s):

Yanran P. Chen ◽

Martin L. Voogel ◽

Ed Priest ◽

Qian Wang ◽

Ranjeeth Doppalapudi ◽

...

Keyword(s):

Time Domain ◽

Power Delivery ◽

Power Delivery Network ◽

Network Characterization ◽

Delivery Network

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Multilayer power delivery network design for high-speed microprocessor system

53rd Electronic Components and Technology Conference, 2003. Proceedings. ◽

10.1109/ectc.2003.1216515 ◽

2004 ◽

Author(s):

Scong-Geun Park ◽

JiSeong Kim ◽

Jong-Gwan Yook ◽

Han-Kyu Park

Keyword(s):

Network Design ◽

Power Delivery ◽

Microprocessor System ◽

Power Delivery Network ◽

Delivery Network

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PowerScout: A Security-Oriented Power Delivery Network Modeling Framework for Cross-Domain Side-Channel Analysis

2020 Asian Hardware Oriented Security and Trust Symposium (AsianHOST) ◽

10.1109/asianhost51057.2020.9358263 ◽

2020 ◽

Author(s):

Huifeng Zhu ◽

Xiaolong Guo ◽

Yier Jin ◽

Xuan Zhang

Keyword(s):

Network Modeling ◽

Power Delivery ◽

Side Channel ◽

Modeling Framework ◽

Side Channel Analysis ◽

Cross Domain ◽

Power Delivery Network ◽

Channel Analysis ◽

Delivery Network

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