Modeling and Analysis a of On-Die Decoupling Capacitance in the Power Delivery Network of an Integrated Chip

Author(s):  
Sungwook Moon ◽  
Seonha Lee
2020 ◽  
Vol 19 (2) ◽  
pp. 543-554
Author(s):  
Weijun Zhu ◽  
Yang Wang ◽  
Gang Dong ◽  
Yintang Yang ◽  
Yuejin Li ◽  
...  

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