Full chip impact study of power delivery network designs in monolithic 3D ICs

2014 ◽  
Author(s):  
Sandeep Kumar Samal ◽  
Kambiz Samadi ◽  
Pratyush Kamal ◽  
Yang Du ◽  
Sung Kyu Lim
Keyword(s):  
Power Delivery ◽  
Impact Study ◽  
3D Ics ◽  
Power Delivery Network ◽  
Delivery Network

scholarly journals Optimization of Power Bumps and TSVs with Optimized Power Mesh Structure for Power Delivery Network in 3D-ICs

2012 ◽  
Vol 16 (2) ◽  
pp. 102-108
Author(s):  
Byung-Gyu Ahn ◽  
Jae-Hwan Kim ◽  
Cheol-Jon Jang ◽  
Jong-Wha Chong
Keyword(s):  
Power Delivery ◽  
Mesh Structure ◽  
3D Ics ◽  
Power Delivery Network ◽  
Delivery Network

MTL-based modeling and analysis of the effects of TSV noise coupling on the power delivery network in 3D ICs

2020 ◽  
Vol 19 (2) ◽  
pp. 543-554
Author(s):  
Weijun Zhu ◽  
Yang Wang ◽  
Gang Dong ◽  
Yintang Yang ◽  
Yuejin Li ◽  
...  
Keyword(s):  
Power Delivery ◽  
Modeling And Analysis ◽  
Noise Coupling ◽  
3D Ics ◽  
Power Delivery Network ◽  
Delivery Network

Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs

2017 ◽  
Vol 36 (6) ◽  
pp. 992-1003 ◽  
Author(s):  
Sandeep Kumar Samal ◽  
Kambiz Samadi ◽  
Pratyush Kamal ◽  
Yang Du ◽  
Sung Kyu Lim
Keyword(s):  
Power Delivery ◽  
Impact Study ◽  
Power Delivery Network ◽  
Delivery Network
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