New underfill material based on copper nanoparticles coated with silica for high thermally conductive and electrically insulating epoxy composites

2019 ◽  
Vol 54 (8) ◽  
pp. 6258-6271 ◽  
Author(s):  
Junhui Li ◽  
Xiang Li ◽  
Yu Zheng ◽  
Zhan Liu ◽  
Qing Tian ◽  
...  
2018 ◽  
Vol 30 (21) ◽  
pp. 7473-7483 ◽  
Author(s):  
Wen Sun ◽  
Lida Wang ◽  
Zhengqing Yang ◽  
Tianzhen Zhu ◽  
Tingting Wu ◽  
...  

2020 ◽  
Vol 12 (24) ◽  
pp. 27476-27484
Author(s):  
Mengxiong Li ◽  
Jiangwei Liu ◽  
Shaoxue Pan ◽  
Jiajia Zhang ◽  
Ya Liu ◽  
...  

2020 ◽  
Vol 12 (14) ◽  
pp. 16987-16996 ◽  
Author(s):  
Xuelong Chen ◽  
Jacob Song Kiat Lim ◽  
Weili Yan ◽  
Fang Guo ◽  
Yen Nan Liang ◽  
...  

RSC Advances ◽  
2016 ◽  
Vol 6 (102) ◽  
pp. 100448-100458 ◽  
Author(s):  
M. Wasim Akhtar ◽  
Yun Seon Lee ◽  
Cheol Min Yang ◽  
Jong Seok Kim

In this study, an effective and novel method was developed to improve the thermal conductivity of epoxy composites by functionalization of graphene.


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