Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

2021 ◽  
Author(s):  
Xi Wang ◽  
Liang Zhang ◽  
Mu-lan Li
Keyword(s):  
Electronics Packaging ◽  
Lead Free ◽  
Microstructure And Properties ◽  
Lead Free Solders

scholarly journals Structure and properties of Sn-Cu lead-free solders in electronics packaging

2019 ◽  
Vol 20 (1) ◽  
pp. 421-444 ◽  
Author(s):  
Meng Zhao ◽  
Liang Zhang ◽  
Zhi-Quan Liu ◽  
Ming-Yue Xiong ◽  
Lei Sun
Keyword(s):  
Electronics Packaging ◽  
Lead Free ◽  
Structure And Properties ◽  
Lead Free Solders

Microstructure and properties of Sn-3.8Ag-0.7Cu-xCe lead-free solders with liquid-liquid structure transition and Ce addition

2019 ◽  
Vol 6 (11) ◽  
pp. 1165b8 ◽  
Author(s):  
Liu Xiaoguang ◽  
Jiang Xiaoming ◽  
Cao Lichao ◽  
Zhai Wengang ◽  
Li Xianfen ◽  
...  
Keyword(s):  
Liquid Structure ◽  
Lead Free ◽  
Structure Transition ◽  
Microstructure And Properties ◽  
Lead Free Solders

scholarly journals Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

2019 ◽  
Vol 9 (10) ◽  
pp. 2044 ◽  
Author(s):  
Peng Zhang ◽  
Songbai Xue ◽  
Jianhao Wang ◽  
Peng Xue ◽  
Sujuan Zhong ◽  
...  
Keyword(s):  
Composite Solder ◽  
High Surface ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Specific Service ◽  
Service Environment ◽  
Microstructure And Properties ◽  
High Surface Energy ◽  
Lead Free Solders ◽  
Ic Package

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

scholarly journals Lead-Free Solders Property and Reliability of Electronics Packaging

2002 ◽  
Vol 2002 (0) ◽  
pp. 225-226
Author(s):  
Harumi YAGI ◽  
Osamu HIGASHI ◽  
Masayuki OCHIAI ◽  
Yoshihisa KAMIYA ◽  
Hitoshi HONMA ◽  
...  
Keyword(s):  
Electronics Packaging ◽  
Lead Free ◽  
Lead Free Solders ◽  
Reliability Of Electronics

Development of SnAg-based lead free solders in electronics packaging

2012 ◽  
Vol 52 (3) ◽  
pp. 559-578 ◽  
Author(s):  
Liang Zhang ◽  
Cheng-wen He ◽  
Yong-huan Guo ◽  
Ji-guang Han ◽  
Yong-wei Zhang ◽  
...  
Keyword(s):  
Electronics Packaging ◽  
Lead Free ◽  
Lead Free Solders
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