2019 International Conference on Electronics Packaging (ICEP)
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Published By IEEE

9784990218874
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Gait Pattern Generation of Hexapod-Type Microrobot Using Interstitial Cell Model Based Hardware Neural Networks IC

2019 ◽  
Author(s):  
Mika Kurosawa ◽  
Takuro Sasaki ◽  
Masaya Ohara ◽  
Taisuke Tanaka ◽  
Yuichiro Hayakawa ◽  
...  
Keyword(s):  
Neural Networks ◽  
Interstitial Cell ◽  
Cell Model ◽  
Gait Pattern ◽  
Pattern Generation ◽  
Model Based

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

2019 ◽  
Author(s):  
Runhua Gao ◽  
Jiahui Li ◽  
Yu-An Shen ◽  
Hiroshi Nishikawa
Keyword(s):  
Formic Acid ◽  
Cu Bonding ◽  
Bonding Method

A High Signal-Integrity PCB-Trace with Embedded Chip Capacitors and Its Design Methodology Using Genetic Algorithm

2019 ◽  
Author(s):  
Moritoshi Yasunaga ◽  
Shumpei Matsuoka ◽  
Yuya Hoshinor ◽  
Takashi Matsumoto ◽  
Tetsuya Odaira
Keyword(s):  
Genetic Algorithm ◽  
Design Methodology ◽  
Signal Integrity ◽  
High Signal ◽  
Embedded Chip

Preparation of Si-Ti based nanofibers and thin film by single-needle electrospinning

2019 ◽  
Author(s):  
Wen-Yu Wang ◽  
Huai-You Lee ◽  
Cho-Liang Chung
Keyword(s):  
Thin Film

A novel TLP bonding based on sub-micron Ga particles

2019 ◽  
Author(s):  
Shih-kang Lin ◽  
Hseng-ming Liao ◽  
Che-yu Yeh ◽  
Chih-han Yang
Keyword(s):  
Tlp Bonding

Gel-Integrated mercury-plated microelectrode arrays for trace metal detection

2019 ◽  
Author(s):  
Zhi Cao ◽  
Haiping Shang ◽  
Yinghui Wang ◽  
Shengkai Wang ◽  
Weibing Wang
Keyword(s):  
Trace Metal ◽  
Microelectrode Arrays ◽  
Metal Detection ◽  
Trace Metal Detection

High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging

2019 ◽  
Author(s):  
Yu-Jin Li ◽  
WEI-YU HSU ◽  
Benson Lin ◽  
ChiaCheng Chang ◽  
Chih Chen
Keyword(s):  
Wafer Level ◽  
High Toughness ◽  
Wafer Level Packaging
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