2019 International Conference on Electronics Packaging (ICEP)

Gait Pattern Generation of Hexapod-Type Microrobot Using Interstitial Cell Model Based Hardware Neural Networks IC

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733603 ◽

2019 ◽

Author(s):

Mika Kurosawa ◽

Takuro Sasaki ◽

Masaya Ohara ◽

Taisuke Tanaka ◽

Yuichiro Hayakawa ◽

...

Keyword(s):

Neural Networks ◽

Interstitial Cell ◽

Cell Model ◽

Gait Pattern ◽

Pattern Generation ◽

Model Based

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A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733490 ◽

2019 ◽

Cited By ~ 1

Author(s):

Runhua Gao ◽

Jiahui Li ◽

Yu-An Shen ◽

Hiroshi Nishikawa

Keyword(s):

Formic Acid ◽

Cu Bonding ◽

Bonding Method

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A High Signal-Integrity PCB-Trace with Embedded Chip Capacitors and Its Design Methodology Using Genetic Algorithm

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733515 ◽

2019 ◽

Cited By ~ 1

Author(s):

Moritoshi Yasunaga ◽

Shumpei Matsuoka ◽

Yuya Hoshinor ◽

Takashi Matsumoto ◽

Tetsuya Odaira

Keyword(s):

Genetic Algorithm ◽

Design Methodology ◽

Signal Integrity ◽

High Signal ◽

Embedded Chip

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Preparation of Si-Ti based nanofibers and thin film by single-needle electrospinning

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733428 ◽

2019 ◽

Author(s):

Wen-Yu Wang ◽

Huai-You Lee ◽

Cho-Liang Chung

Keyword(s):

Thin Film

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GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733484 ◽

2019 ◽

Author(s):

Thomas Blank ◽

Volker Dudek ◽

Matthias Luh ◽

Bao Ngoc An ◽

Helge Wurst ◽

...

Keyword(s):

Electric Vehicle ◽

Power Module ◽

Large Area ◽

Battery Charging ◽

Electric Vehicle Battery

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Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733501 ◽

2019 ◽

Author(s):

Ami Tezuka ◽

Hiroyuki Kuwae ◽

Kosuke Yamada ◽

Shuichi Shoji ◽

Shoji Kakio ◽

...

Keyword(s):

Residual Stress ◽

Acoustic Wave ◽

Surface Acoustic Wave ◽

Amorphous Film ◽

Film Deposition ◽

Deposition Method ◽

Acoustic Wave Devices

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A novel TLP bonding based on sub-micron Ga particles

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733446 ◽

2019 ◽

Author(s):

Shih-kang Lin ◽

Hseng-ming Liao ◽

Che-yu Yeh ◽

Chih-han Yang

Keyword(s):

Tlp Bonding

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Gel-Integrated mercury-plated microelectrode arrays for trace metal detection

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733427 ◽

2019 ◽

Author(s):

Zhi Cao ◽

Haiping Shang ◽

Yinghui Wang ◽

Shengkai Wang ◽

Weibing Wang

Keyword(s):

Trace Metal ◽

Microelectrode Arrays ◽

Metal Detection ◽

Trace Metal Detection

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High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging

2019 International Conference on Electronics Packaging (ICEP) ◽

10.23919/icep.2019.8733599 ◽

2019 ◽

Author(s):

Yu-Jin Li ◽

WEI-YU HSU ◽

Benson Lin ◽

ChiaCheng Chang ◽

Chih Chen

Keyword(s):

Wafer Level ◽

High Toughness ◽

Wafer Level Packaging

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2019 International Conference on Electronics Packaging (ICEP)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Table of contents

Gait Pattern Generation of Hexapod-Type Microrobot Using Interstitial Cell Model Based Hardware Neural Networks IC

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

A High Signal-Integrity PCB-Trace with Embedded Chip Capacitors and Its Design Methodology Using Genetic Algorithm

Preparation of Si-Ti based nanofibers and thin film by single-needle electrospinning

GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

A novel TLP bonding based on sub-micron Ga particles

Gel-Integrated mercury-plated microelectrode arrays for trace metal detection

High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging

Export Citation Format

2019 International Conference on Electronics Packaging (ICEP)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Table of contents

Gait Pattern Generation of Hexapod-Type Microrobot Using Interstitial Cell Model Based Hardware Neural Networks IC

A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere

A High Signal-Integrity PCB-Trace with Embedded Chip Capacitors and Its Design Methodology Using Genetic Algorithm

Preparation of Si-Ti based nanofibers and thin film by single-needle electrospinning

GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging

Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

A novel TLP bonding based on sub-micron Ga particles

Gel-Integrated mercury-plated microelectrode arrays for trace metal detection

High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging

2019 International Conference on Electronics Packaging (ICEP)
Latest Publications