Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-07501-1 ◽

2022 ◽

Author(s):

Zih-You Wu ◽

Tzu-Chia Wang ◽

Yu-Ching Wang ◽

Rui-Wen Song ◽

Su-Yueh Tsai ◽

...

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding

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Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding

10.1109/eptc53413.2021.9663953 ◽

2021 ◽

Author(s):

Yi Chen ◽

Shuibao Liang ◽

Canyu Liu ◽

Changqing Liu ◽

Zhaoxia Zhou

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Cu Interconnects ◽

Interfacial Characteristics

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Microstructure and mechanical properties of magnesium alloys joints with Ag-Cu interlayer by ultrasonic-induced transient liquid phase bonding in air for structure lightweight design

Materials Letters ◽

10.1016/j.matlet.2018.11.058 ◽

2019 ◽

Vol 237 ◽

pp. 37-40 ◽

Author(s):

Qian Wang ◽

Yang Fu ◽

Qiang Lang ◽

Jiuchun Yan ◽

Shengyong Chen

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Magnesium Alloys ◽

Lightweight Design ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microstructure And Mechanical Properties ◽

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Transient liquid phase bonding of Gamma Met PX: microstructure and mechanical properties

Materials Science and Technology ◽

10.1179/174328407x236535 ◽

2008 ◽

Vol 24 (12) ◽

pp. 1492-1500 ◽

Author(s):

D. A. Butts ◽

W. F. Gale

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microstructure And Mechanical Properties

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Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-016-4366-z ◽

2016 ◽

Vol 27 (5) ◽

pp. 4839-4848 ◽

Author(s):

Huakai Shao ◽

Aiping Wu ◽

Yudian Bao ◽

Yue Zhao ◽

Guisheng Zou

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Low Temperature ◽

Interfacial Reaction ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Temperature Transient

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Microstructure and mechanical properties of Ti-48Al-2Cr-2Nb alloy joints produced by transient liquid phase bonding using spark plasma sintering

Materials Characterization ◽

10.1016/j.matchar.2018.10.024 ◽

2019 ◽

Vol 147 ◽

pp. 116-126 ◽

Author(s):

J.M. Liang ◽

L. Cao ◽

Y.H. Xie ◽

Y. Zhou ◽

Y.F. Luo ◽

...

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Spark Plasma Sintering ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microstructure And Mechanical Properties ◽

Plasma Sintering ◽

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Effect of Bonding Misfit on Mechanical Properties of TLP-Bonded Joints at Elevated Temperature. Transient Liquid Phase Bonding of Ni-Base Single Crystal Supealloy. (Report 7).

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY ◽

10.2207/qjjws.18.133 ◽

2000 ◽

Vol 18 (1) ◽

pp. 133-140 ◽

Author(s):

Kazutoshi NISHIMOTO ◽

Kazuyoshi SAIDA ◽

Daeup KIM ◽

Satoru ASAI ◽

Yasuhiro FURUKAWA

Keyword(s):

Mechanical Properties ◽

Elevated Temperature ◽

Liquid Phase ◽

Single Crystal ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Bonded Joints ◽

Temperature Transient

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Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.3009515 ◽

2020 ◽

Vol 10 (10) ◽

pp. 1604-1610

Author(s):

Nadeesh Singh Nobeen ◽

Guangxu Yan ◽

Chee Lip Gan ◽

Zhong Chen

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

High Temperature Electronic ◽

Packaging Effect

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Effect of powders on microstructures and mechanical properties for Sn–Ag transient liquid phase bonding in air

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-018-9076-2 ◽

2018 ◽

Vol 29 (12) ◽

pp. 10246-10257 ◽

Author(s):

Yudian Bao ◽

Aiping Wu ◽

Huakai Shao ◽

Yue Zhao ◽

Guisheng Zou

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microstructures And Mechanical Properties

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Transient liquid phase bonding of dissimilar nickel base superalloys — wettability, microstructure and mechanical properties

Materials Science and Technology ◽

10.1179/174328408x293478 ◽

2008 ◽

Vol 24 (5) ◽

pp. 517-528 ◽

Author(s):

R. Aluru ◽

W. F. Gale ◽

S. V. Chitti ◽

N. Sofyan ◽

R. D. Love ◽

...

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Microstructure And Mechanical Properties ◽

Nickel Base Superalloys ◽

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Transient Liquid Phase Bonding of HP Alloy (Report 1). Effect of Bonding Conditions on the Mechanical Properties of Joint at the Elevated Temperature.

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY ◽

10.2207/qjjws.15.108 ◽

1997 ◽

Vol 15 (1) ◽

pp. 108-114 ◽

Author(s):

Kazutoshi Nishimoto ◽

Kazuyoshi Saida ◽

Akihisa Mochizuki ◽

Masahiro Inui ◽

Makoto Takahashi

Keyword(s):

Mechanical Properties ◽

Elevated Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding

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