Ag–Sn Transient Liquid Phase Bonding for High Temperature Electronic Packaging: Effect of Ag Content

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.3009515 ◽

2020 ◽

Vol 10 (10) ◽

pp. 1604-1610

Author(s):

Nadeesh Singh Nobeen ◽

Guangxu Yan ◽

Chee Lip Gan ◽

Zhong Chen

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

High Temperature Electronic ◽

Packaging Effect

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Nickel–Tin Transient Liquid Phase Bonding Toward High-Temperature Operational Power Electronics in Electrified Vehicles

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2012.2212211 ◽

2013 ◽

Vol 28 (5) ◽

pp. 2448-2456 ◽

Author(s):

Sang Won Yoon ◽

Michael D. Glover ◽

Koji Shiozaki

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Power Electronics ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Electrified Vehicles

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Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound

Ultrasonics Sonochemistry ◽

10.1016/j.ultsonch.2017.02.016 ◽

2017 ◽

Vol 37 ◽

pp. 561-570 ◽

Author(s):

Huakai Shao ◽

Aiping Wu ◽

Yudian Bao ◽

Yue Zhao ◽

Lei Liu ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

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Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles

2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec.2012.6165863 ◽

2012 ◽

Author(s):

Sang Won Yoon ◽

Koji Shiozaki ◽

Satoshi Yasuda ◽

Michael D. Glover

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Power Electronics ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Bonding Technology ◽

Electrified Vehicles

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Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2016.2535365 ◽

2017 ◽

Vol 32 (1) ◽

pp. 441-451 ◽

Author(s):

Hongtao Chen ◽

Tianqi Hu ◽

Mingyu Li ◽

Zhenqing Zhao

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Shell Structure ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Powder Preform ◽

Core Shell Structure ◽

Temperature Applications

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Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Ultrasonics Sonochemistry ◽

10.1016/j.ultsonch.2016.12.026 ◽

2017 ◽

Vol 36 ◽

pp. 420-426 ◽

Author(s):

Z.L. Li ◽

H.J. Dong ◽

X.G. Song ◽

H.Y. Zhao ◽

J.C. Feng ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Bonding Process ◽

Transient Liquid Phase Bonding ◽

Power Devices ◽

Die Attachment ◽

Rapid Formation

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Low Temperature Ni/Sn/Ni Transient Liquid Phase Bonding for High Temperature Packaging Applications by Imposing Temperature Gradient

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.267 ◽

2017 ◽

Author(s):

Y. Zhong ◽

N. Zhao ◽

H. T. Ma ◽

W. Dong ◽

M. L. Huang ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Low Temperature ◽

Temperature Gradient ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding

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Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-017-6479-4 ◽

2017 ◽

Vol 28 (11) ◽

pp. 7827-7833 ◽

Author(s):

Byung-Suk Lee ◽

Soong-Keun Hyun ◽

Jeong-Won Yoon

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Power Electronics ◽

Transient Liquid Phase ◽

Electronics Packaging ◽

Transient Liquid Phase Bonding ◽

Technology Applications

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Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-021-07501-1 ◽

2022 ◽

Author(s):

Zih-You Wu ◽

Tzu-Chia Wang ◽

Yu-Ching Wang ◽

Rui-Wen Song ◽

Su-Yueh Tsai ◽

...

Keyword(s):

Mechanical Properties ◽

Liquid Phase ◽

Electronic Packaging ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding

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Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging

Materials Science and Engineering A ◽

10.1016/j.msea.2018.03.097 ◽

2018 ◽

Vol 724 ◽

pp. 231-238 ◽

Author(s):

Huakai Shao ◽

Aiping Wu ◽

Yudian Bao ◽

Yue Zhao ◽

Guisheng Zou ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Power Devices ◽

Capillary Action

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Micron Sn-Cu Composite Solder for High-Temperature Applications Based on Transient Liquid Phase Bonding

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202861 ◽

2020 ◽

Author(s):

Fan Yang ◽

Weizhen Wu ◽

Wenbo Zhu ◽

Mingyu Li

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Composite Solder ◽

Transient Liquid Phase ◽

Transient Liquid Phase Bonding ◽

Temperature Applications

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