Thermal control of electronic components using a liquid around the phase change material

2019 ◽  
Vol 140 (3) ◽  
pp. 1177-1189 ◽  
Author(s):  
Haythem Shili ◽  
Kamel Fahem ◽  
Souad Harmand ◽  
Sadok Ben Jabrallah
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Control ◽  
Electronic Components ◽  
Change Material

scholarly journals The effect of water’s presence around the Phase Change Material

2020 ◽  
Vol 24 (6 Part B) ◽  
pp. 4049-4059 ◽  
Author(s):  
Haythem Shili ◽  
Kamel Fahem ◽  
Souad Harmand ◽  
Jabrallah Ben
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Protection ◽  
Flow Direction ◽  
Operating Time ◽  
Thermal Control ◽  
Melting Time ◽  
Standard Case ◽  
Time Flow ◽  
Change Material

As part of the research in the field of thermal control of electronic components, a phase change material is confined in a liquid and is heated vertically on one side by a hot plate. The presence of the liquid around the phase change material prevents the formation of air bubbles produced in case of direct contact between the hotplate and the phase change material (extends the lifetime of the phase change material by reducing overheating zones). It improves heat transfer by increasing the thermal conductivity around the phase change material (raising the thermal exchange surface) and by accelerating the convective transfer. This work examines experimentally and numerically the effect of the water on the phase change material and on the heating plate. The water is used around the phase change material and a comparative study of the comportment of some important parameters like the melt front form, melting time, flow direction, temperature, and operating time is realized. It is found that the presences of the liquid around the phase change material seems to be more interesting for a thermal protection role than the standard case of the phase change material directly heated by the hotplate.

A hollow microlattice based ultralight active thermal control device and its fabrication techniques and thermal performances

2021 ◽  
Author(s):  
Wenjun Xu ◽  
Longquan Liu ◽  
Junming Chen ◽  
Xinying Lv ◽  
Yongtao Yao
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Forced Convection ◽  
Liquid State ◽  
High Efficiency ◽  
Thermal Control ◽  
Test System ◽  
Control Device ◽  
Active Cooling ◽  
Change Material

Abstract This paper introduces a new thermal control device which has not only low weight and high efficiency but also passive and active cooling capabilities. The thermal control device mainly consists of hollow graphene-enhanced-metallic microlattice material, phase change material (PCM) and a peristatic pump. The PCM is inside the spatial-interconnected millimeter-scale diameter tubes, which are the basic constitution of the hollow microlattice material, in addition, the peristatic pump was connected with the tubes and used to force the liquid-state PCM to circulate inside the interconnected thin tubes. Thus, the proposed thermal control device takes combined advantages of the ultralight and high thermal transfer properties of the hollow graphene-enhanced-metallic microlattice materials, the thermal storage capability of the PCM and forced convection of the PCM driven by the peristatic pump as the PCM is in liquid state. The manufacturing process of the active thermal control device was also developed and proposed, which mainly includes additive manufacturing, composite electroless plating, polymer etching, liquid phase change material injecting and the peristatic pump connecting. In addition to that, a thermal test system was built and the effective thermal conductivities of the thermal control device in passive cooling and with active cooling modes were experimentally studied. The thermal control device can absorb heat and actively dissipate heat by means of forced convection. Consequently, the proposed active thermal control device can be used to guarantee the electronic components and spacecrafts operate in a specific temperature range.

Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components

2021 ◽  
Author(s):  
Adeel Arshad ◽  
Mark Jabbal ◽  
Hamza Faraji ◽  
Pouyan Talebizadehsardari ◽  
Muhammad Anser Bashir ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Heat Sink ◽  
Numerical Study ◽  
Passive Cooling ◽  
Electronic Components ◽  
Change Material

scholarly journals Satellite Thermal Control Device Enhanced by Latent Heat of the Phase Change Material

2016 ◽  
Vol 44 (10) ◽  
pp. 887-894
Author(s):  
Tae Su Kim ◽  
Yoon Sub Shin ◽  
Taig Young Kim ◽  
Jung-gi Seo ◽  
Bum-Seok Hyun ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Latent Heat ◽  
Thermal Control ◽  
Control Device ◽  
Change Material

scholarly journals Thermal Management of Transient Power Spikes in Electronics: Phase Change Energy Storage or Copper Heat Sinks??

2003 ◽  
Author(s):  
Shankar Krishnan ◽  
Suresh V. Garimella
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Phase Change Materials ◽  
Electronics Cooling ◽  
Thermal Control ◽  
Heat Sinks ◽  
Melting Time ◽  
Power Semiconductors ◽  
Design Calculations ◽  
Change Material

A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin waxes and metallic alloys) are considered, with and without the use of thermal conductivity enhancers. Simple expressions for the melt depth, melting time and temperature distribution are presented in terms of the dimensions of the heat sink and the thermophysical properties of the phase change material, to aid in the design of passive thermal control systems. The simplified analytical expressions are verified against more complex numerical simulations, and are shown to be excellent tools for design calculations. The suppression of junction temperatures achieved by the use of phase change materials when compared to the performance with copper heat sinks is illustrated. Merits of employing phase change materials for pulsed power electronics cooling applications are discussed.

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