A high speed multi-level-parallel array processor for vision chips

This paper presents two advances towards the automated three-dimensional (3-D) analysis of thick and heavily-overlapped regions in cytological preparations such as cervical/vaginal smears. First, a high speed 3-D brightfield microscope has been developed, allowing the acquisition of image data at speeds approaching 30 optical slices per second. Second, algorithms have been developed to detect and segment nuclei in spite of the extremely high image variability and low contrast typical of such regions. The analysis of such regions is inherently a 3-D problem that cannot be solved reliably with conventional 2-D imaging and image analysis methods.High-Speed 3-D imaging of the specimen is accomplished by moving the specimen axially relative to the objective lens of a standard microscope (Zeiss) at a speed of 30 steps per second, where the stepsize is adjustable from 0.2 - 5μm. The specimen is mounted on a computer-controlled, piezoelectric microstage (Burleigh PZS-100, 68/μm displacement). At each step, an optical slice is acquired using a CCD camera (SONY XC-11/71 IP, Dalsa CA-D1-0256, and CA-D2-0512 have been used) connected to a 4-node array processor system based on the Intel i860 chip.

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High Speed Multi-level Discrete Wavelet Transform using Canonic Signed Digit Technique

International Journal of Computer Sciences and Engineering ◽

10.26438/ijcse/v7i5.15281531 ◽

2019 ◽

Vol 7 (5) ◽

pp. 1528-1531

Author(s):

Kapil Sharma ◽

Ompal Singh ◽

Abhishek Bhatt

Keyword(s):

Wavelet Transform ◽

Discrete Wavelet Transform ◽

High Speed ◽

Discrete Wavelet ◽

Canonic Signed Digit ◽

Multi Level

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Aluminum Reflow Sputtering

MRS Bulletin ◽

10.1557/s0883769400045577 ◽

1995 ◽

Vol 20 (11) ◽

pp. 53-56 ◽

Cited By ~ 3

Author(s):

Kuniko Kikuta

Keyword(s):

Integrated Circuit ◽

High Speed ◽

Lower Cost ◽

High Reliability ◽

Device Fabrication ◽

Damascene Process ◽

Aspect Ratios ◽

Multi Level ◽

Poor Adhesion ◽

Lower Resistivity

The scaling of integrated-circuit device dimensions in the horizontal direction has caused an increase in aspect ratios of contact holes and vias without a corresponding scaledown in vertical dimensions. Conventional sputtering has become unreliable for handling higher aspect-ratio via/contact holes because of its poor step coverage. Several studies have attempted to overcome this problem by using W-CVD and reflow technology. The W-CVD is used for practical device fabrications. However, this technique has several problems such as poor adhesion to SiO2, poor W surface morphology, greater resistivity than Al, and the need of an etch-back process.Al reflow technology using a conventional DC magnetron sputtering system can simplify device-fabrication processes and achieve high reliability without Al/W interfaces. In particular, the Al reflow technology is profitable for multi-level interconnections in combination with a damascene process by using Al chemical mechanical polishing (CMP). These interconnections are necessary for miniaturized and high-speed devices because they provide lower resistivity than W and simplify fabrication processes, resulting in lower cost.This article describes recent Al reflow sputtering technologies as well as application of via and interconnect metallization.

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High-Order Multi-Level Optical Transmission for beyond 100 Gb/s Using High-Speed DACs

2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) ◽

10.1109/csics.2011.6062478 ◽

2011 ◽

Cited By ~ 3

Author(s):

Shogo Yamanaka ◽

Takayuki Kobayashi ◽

Munehiko Nagatani

Keyword(s):

High Speed ◽

Optical Transmission ◽

High Order ◽

Multi Level

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Multiple Signal Classification (MUSIC) Algorithm Hosted On The High Speed Systolic Array Processor (HISSAP)

10.1117/12.948565 ◽

1989 ◽

Author(s):

Joseph P. Loughlin

Keyword(s):

Systolic Array ◽

High Speed ◽

Signal Classification ◽

Array Processor ◽

Music Algorithm ◽

Multiple Signal Classification ◽

Multiple Signal

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Nearby Phase Search Algorithm with Reduced Complexity for Higher Order QAM Formats

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.760-762.1869 ◽

2013 ◽

Vol 760-762 ◽

pp. 1869-1873

Author(s):

Li Min Xia ◽

Xian Zhou ◽

Dong Yan ◽

Na Na Zhang ◽

Xiao Yun Wu

Keyword(s):

Computational Complexity ◽

Bit Error Rate ◽

High Speed ◽

Optical Transmission ◽

Search Algorithm ◽

Estimation Algorithm ◽

Coherent Receivers ◽

Multi Level ◽

Reduced Complexity ◽

Laser Line Width

This paper proposes a nearby phase search (NPS) algorithm based on BPS estimation algorithm in optical coherent receivers. And its suitable for arbitrary multi-level modulation. Making use of the continuity of phase change, the proposed NPS algorithm is applied to process nearby symbols by taking the pre-estimation phase of each symbol block as reference point. Compared to the traditional blind phase search (BPS) algorithm and its improved two-stage BPS algorithm, the performance of the proposed NPS algorithm is greatly improved in ultra-high speed coherent optical transmission system. By the simulation, the effectiveness and feasibility of the proposed algorithm are demonstrated in 28GBaud 16-QAM and 64-QAM system. Its shown that the computational complexity of the NPS algorithm greatly reduces in the guarantee of laser line width tolerance and bit error rate.

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