High-temperature compression and electron backscatter diffraction (EBSD) techniques were used in a systematic investigation of the dynamic recrystallization (DRX) behavior and texture evolution of the Inconel625 alloy. The true stress–true strain curves and the constitutive equation of Inconel625 were obtained at temperatures ranging from 900 to 1200 °C and strain rates of 10, 1, 0.1, and 0.01 s−1. The adiabatic heating effect was observed during the hot compression process. At a high strain rate, as the temperature increased, the grains initially refined and then grew, and the proportion of high-angle grain boundaries increased. The volume fraction of the dynamic recrystallization increased. Most of the grains were randomly distributed and the proportion of recrystallized texture components first increased and then decreased. Complete dynamic recrystallization occurred at 1100 °C, where the recrystallized volume fraction and the random distribution ratios of grains reached a maximum. This study indicated that the dynamic recrystallization mechanism of the Inconel625 alloy at a high strain rate included continuous dynamic recrystallization with subgrain merging and rotation, and discontinuous dynamic recrystallization with bulging grain boundary induced by twinning. The latter mechanism was less dominant.
Dynamic Recrystallization During High-Strain-Rate Tension of Copper
