Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering

2000 ◽  
Vol 29 (10) ◽  
pp. 1153-1159 ◽  
Author(s):  
Jong-Hyun Lee ◽  
Daejin Park ◽  
Jong-Tae Moon ◽  
Yong-Ho Lee ◽  
Dong-Hyuk Shin ◽  
...  
Keyword(s):  
Solder Bump ◽  
Reflow Soldering ◽  
Eutectic Solder

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

2013 ◽  
Vol 53 (9-11) ◽  
pp. 1581-1586 ◽  
Author(s):  
F.L. Lau ◽  
Riko. I Made ◽  
W.N. Putra ◽  
J.Z. Lim ◽  
V.C. Nachiappan ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Bump ◽  
Electrical Behavior ◽  
Eutectic Solder ◽  
High Temperature Electronics

Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

2001 ◽  
Vol 30 (9) ◽  
pp. 1152-1156 ◽  
Author(s):  
C. M. Liu ◽  
C. E. Ho ◽  
W. T. Chen ◽  
C. R. Kao
Keyword(s):  
Solid State ◽  
Surface Finish ◽  
Reflow Soldering ◽  
Eutectic Solder

Microstructure and Composition of Au-Sn Eutectic Solder Electroplated from a Single Solution

2005 ◽  
Vol 894 ◽  
Author(s):  
G. H. Jeong ◽  
J. H. Kim ◽  
Duhyun Lee ◽  
S. J. Suh
Keyword(s):  
Solder Bump ◽  
Pulse Current ◽  
Xrd Analysis ◽  
Pulsed Current ◽  
Eutectic Solder ◽  
Single Solution ◽  
Ausn Phase ◽  
Si Wafer

AbstractIn this study, we produced Au-Sn alloy electroplated from a single solution and optimized the composition. The composition of electroplated Au-Sn alloy was Au-31.02 at.% Sn at the condition of 6 ms on - 4 ms off pulse current, 50 °C and 10 mA/cm2. Results in XRD analysis showed that Au-Sn alloy electroplated at DC 10 mA/cm2 had AuSn phase (δ) only and Au5Sn phase (d) appeared with decreasing the pulsed current on time. Also micro-patterned Au-Sn solder bump was produced by photolithography. Though it’s composition of Au-35.98 at.% Sn was not optimum, we tried to bond between Au-Sn solder bump and Si wafer that was coated with Ti (100 nm)/Au (300 nm).

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration

2006 ◽  
Vol 46 (12) ◽  
pp. 2104-2111 ◽  
Author(s):  
Kuo-Ming Chen ◽  
J.D. Wu ◽  
Kuo-Ning Chiang
Keyword(s):  
Solder Bump ◽  
Eutectic Solder
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