A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding

2007 ◽  
Vol 36 (5) ◽  
pp. 587-592 ◽  
Author(s):  
Chun-Mei Li ◽  
Ping Yang ◽  
De-Ming Liu ◽  
Ngar-Chun Hung ◽  
Ming Li
2020 ◽  
Vol 218 ◽  
pp. 113073 ◽  
Author(s):  
Ryan DeMott ◽  
Peter Collins ◽  
Charlie Kong ◽  
Xiaozhou Liao ◽  
Simon Ringer ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document