The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration

2013 ◽  
Vol 43 (1) ◽  
pp. 43-51 ◽  
Author(s):  
Xioranny Linares ◽  
Chris Kinney ◽  
Kyu-Oh Lee ◽  
J. W. Morris
2020 ◽  
Vol 218 ◽  
pp. 113073 ◽  
Author(s):  
Ryan DeMott ◽  
Peter Collins ◽  
Charlie Kong ◽  
Xiaozhou Liao ◽  
Simon Ringer ◽  
...  

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