Micro-Power Generation Characteristics of Thermoelectric
Thin Film Devices Processed by Electrodeposition
and Flip-Chip Bonding
2015 ◽
Vol 44
(6)
◽
pp. 2026-2033
◽
Keyword(s):
2013 ◽
Vol 43
(6)
◽
pp. 1933-1939
◽
2012 ◽
Vol 53
(12)
◽
pp. 2160-2165
◽
2008 ◽
Vol 21
(12)
◽
pp. 1135-1140
Keyword(s):
2016 ◽
Vol 45
(7)
◽
pp. 3410-3417
◽
Keyword(s):
2015 ◽
Vol 7
(1)
◽
pp. 144-150
◽