Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding
2012 ◽
Vol 53
(12)
◽
pp. 2160-2165
◽
Min-Young Kim
◽
Tae-Sung Oh
2015 ◽
Vol 56
(10)
◽
pp. 1719-1724
Kang-Je Shin
◽
Tae-Sung Oh
2015 ◽
Vol 44
(6)
◽
pp. 2026-2033
◽
Kang-Je Shin
◽
Tae-Sung Oh
R. Bonda
◽
T. Fang
◽
B. Hileman
◽
D. Spigler
◽
J. Stafford
◽
...
D.L. Smith
◽
D.K. Fork
◽
R.L. Thornton
◽
A.S. Alimonda
◽
C.L. Chua
◽
...
Likai Yang
◽
Sihao Wang
◽
Mohan Shen
◽
Yuntao Xu
◽
Jia-Cheng Xie
◽
...
2005 ◽
Vol 88
(4)
◽
pp. 37-45
◽
Naoya Tamaki
◽
Norio Masuda
◽
Toshihide Kuriyama
◽
Jin-Ching Bu
◽
Masahiro Yamaguchi
◽
...
2020 ◽
Vol 19
(0)
◽
pp. 101-110
Rikushi KATO
◽
Masanori MATSUSHITA
◽
Hideyuki TAKAHASHI
◽
Osamu MORI
◽
Nobukatsu OKUIZUMI
◽
...
2019 ◽
Vol 18
(0)
◽
pp. 73-80
◽
Masanori MATSUSHITA
◽
Nobukatsu OKUIZUMI
◽
Yasutaka SATOU
◽
Osamu MORI
◽
Takashi IWASA
◽
...
2019 ◽
Vol 95
◽
pp. 48-53
Chun-Han Ku
◽
Wei-Kai Wang
◽
Ray-Hua Horng
Peian Li
◽
Xu Zhang
◽
Wing Cheung Chong
◽
Kei May Lau