Flip-chip bonding on 6-μm pitch using thin-film microspring technology

2002 ◽  
Author(s):  
D.L. Smith ◽  
D.K. Fork ◽  
R.L. Thornton ◽  
A.S. Alimonda ◽  
C.L. Chua ◽  
...  
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
Flip Chip Bonding

scholarly journals Photonic integration of Er3+:Y₂SiO₅ and thin-film lithium niobate by flip chip bonding

2021 ◽  
Author(s):  
Likai Yang ◽  
Sihao Wang ◽  
Mohan Shen ◽  
Yuntao Xu ◽  
Jia-Cheng Xie ◽  
...  
Keyword(s):  
Thin Film ◽  
Lithium Niobate ◽  
Flip Chip ◽  
Photonic Integration ◽  
Flip Chip Bonding

A miniature thin-film shielded-loop probe with a flip-chip bonding for magnetic near field measurements

2005 ◽  
Vol 88 (4) ◽  
pp. 37-45 ◽  
Author(s):  
Naoya Tamaki ◽  
Norio Masuda ◽  
Toshihide Kuriyama ◽  
Jin-Ching Bu ◽  
Masahiro Yamaguchi ◽  
...  
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
Near Field ◽  
Field Measurements ◽  
Flip Chip Bonding

Monolithic Thin Film Red LED Active-matrix Micro-display by Flip-chip Technology

2021 ◽  
pp. 1-1
Author(s):  
Peian Li ◽  
Xu Zhang ◽  
Wing Cheung Chong ◽  
Kei May Lau
Keyword(s):  
Thin Film ◽  
Flip Chip ◽  
Active Matrix ◽  
Chip Technology ◽  
Red Led

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding
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