Reassessment of Atomic Mobilities in fcc Cu-Ag-Sn System Aiming at Establishment of an Atomic Mobility Database in Sn-Ag-Cu-In-Sb-Bi-Pb Solder Alloys

2016 ◽  
Vol 46 (4) ◽  
pp. 2119-2129 ◽  
Author(s):  
Huixia Xu ◽  
Lijun Zhang ◽  
Kaiming Cheng ◽  
Weimin Chen ◽  
Yong Du
Keyword(s):  
Atomic Mobility ◽  
Solder Alloys ◽  
Mobility Database

A New Diffusivity Database for Multi-Component Al Alloys: Focusing on Ternary Systems and its Effect on Microstructure Evolution during Solidification

2014 ◽  
Vol 794-796 ◽  
pp. 611-616 ◽  
Author(s):  
Li Jun Zhang ◽  
Dan Dan Liu ◽  
Wei Bin Zhang ◽  
Shao Qing Wang ◽  
Ying Tang ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Hybrid Approach ◽  
Ternary Systems ◽  
Atomic Mobility ◽  
First Principles Calculations ◽  
Liquid Phases ◽  
Diffusion Controlled ◽  
Mobility Database ◽  
Diffusion Paths ◽  
Diffusion Properties

A new atomic mobility database for Fcc_A1, L12, Bcc_A2, Bcc_B2, and liquid phases in the Al-Cu-Fe-Mg-Mn-Ni-Si-Zn system has been established via a hybrid approach of experiment, first-principles calculations and DICTRA (DIffusion Controlled TRAnsformation) software, focusing on the atomic mobility parameters in ternary systems. Various diffusivities can be computed as a function of temperature and composition. The reliability of this diffusivity database is further validated by comparing the calculated and measured diffusion properties in a series of ternary and quaternary diffusion couples, including concentration profiles, diffusion paths, interdiffusion fluxes, and so on. The effect of the diffusivity database on microstructure evolution during solidification is demonstrated by the phase field simulation of primary (Al) grains in Al356.1 alloy. The simulation results indicate that such accurate diffusivity database is highly needed for the quantitative simulation of microstructural evolution during solidification.

scholarly journals An Effective Strategy to Maintain the CALPHAD Atomic Mobility Database of Multicomponent Systems and Its Application to Hcp Mg–Al–Zn–Sn Alloys

Materials ◽  
2021 ◽  
Vol 15 (1) ◽  
pp. 283
Author(s):  
Ting Cheng ◽  
Jing Zhong ◽  
Lijun Zhang
Keyword(s):  
Numerical Method ◽  
Traditional Method ◽  
The Self ◽  
Multicomponent Systems ◽  
Atomic Mobility ◽  
Effective Strategy ◽  
Mobility Database ◽  
Self Consistent ◽  
New Strategy ◽  
Comprehensive Comparison

In this paper, a general and effective strategy was first developed to maintain the CALPHAD atomic mobility database of multicomponent systems, based on the pragmatic numerical method and freely accessible HitDIC software, and then applied to update the atomic mobility descriptions of the hcp Mg–Al–Zn, Mg–Al–Sn, and Mg–Al–Zn–Sn systems. A set of the self-consistent atomic mobility database of the hcp Mg–Al–Zn–Sn system was established following the new strategy presented. A comprehensive comparison between the model-predicted composition–distance profiles/inter-diffusivities in the hcp Mg–Al–Zn, Mg–Al–Sn, and Mg–Al–Zn–Sn systems from the presently updated atomic mobilities and those from the previous ones that used the traditional method indicated that significant improvement can be achieved utilizing the new strategy, especially in the cases with sufficient experimental composition–distance profiles and/or in higher-order systems. Furthermore, it is anticipated that the proposed strategy can serve as a standard for maintaining the CALPHAD atomic mobility database in different multicomponent systems.

scholarly journals 40.1: Invited Paper: Use of flash lamps to achieve non‐equilibrium soldering and assembly using conventional solder alloys

2021 ◽  
Vol 52 (S1) ◽  
pp. 275-275
Author(s):  
Rudy Ghosh ◽  
Vahid Akhavan ◽  
Harry Chou ◽  
Vikram Turkani ◽  
Stan Farnsworth
Keyword(s):  
Solder Alloys ◽  
Non Equilibrium

Constitutive modeling of solder alloys for drop-impact applications

2016 ◽  
Vol 67 ◽  
pp. 135-142 ◽  
Author(s):  
E.H. Wong ◽  
J. Chrisp ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah
Keyword(s):  
Constitutive Modeling ◽  
Drop Impact ◽  
Solder Alloys

Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys

2013 ◽  
Vol 3 (11) ◽  
pp. 1868-1875 ◽  
Author(s):  
Uttara Sahaym ◽  
Babak Talebanpour ◽  
Sean Seekins ◽  
Indranath Dutta ◽  
Praveen Kumar ◽  
...  
Keyword(s):  
Thermomechanical Treatment ◽  
Solder Alloys
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