Effect of Strain Rate on the Microstructure Evolution and Compressive Deformation Behavior of High-Strength Cu Bulk Material Manufactured by Cold Spray Process

2019 ◽  
Vol 28 (5) ◽  
pp. 917-929 ◽  
Author(s):  
Min-Seok Baek ◽  
Young-Kyun Kim ◽  
Kee-Ahn Lee
Keyword(s):  
Strain Rate ◽  
Cold Spray ◽  
Microstructure Evolution ◽  
Deformation Behavior ◽  
Bulk Material ◽  
High Strength ◽  
Compressive Deformation ◽  
Cold Spray Process ◽  
Spray Process

scholarly journals Tensile and Compressive Deformation Behaviors of High-Strength Cu Bulk Material Manufactured by Cold Spray

2020 ◽  
Vol 58 (11) ◽  
pp. 759-767
Author(s):  
Young-Kyun Kim ◽  
Kee-Ahn Lee
Keyword(s):  
Plastic Deformation ◽  
Cold Spray ◽  
Deformation Behavior ◽  
Bulk Material ◽  
High Strength ◽  
Compressive Deformation ◽  
Temperature Deformation ◽  
General Tendency ◽  
Deformation Behaviors ◽  
Pure Cu

In this study, high-strength pure Cu bulk material was manufactured using a cold spray additive manufacturing process, and its microstructure, tensile and compressive deformation behaviors were investigated and compared. The cold spray additive manufactured Cu bulk material showed a heterogeneous grain structure consisting of fine-grains and coarse-grains, and only α – Cu single phase was identified. The cold spray Cu exhibited yield strengths of ~415 MPa in tensile- and compression tests, indicating that it had similar mechanical properties in different deformation modes. The yield strength values were similar to that of Cu manufactured by equal channel angular pressing (ECAP), a severe plastic deformation (SPD) method which enables ultra-high strength. Concerning tensile characteristics, the cold sprayed Cu exhibited partial plastic deformation that has not been reported to date. In addition, some nano-sized dimples, suggesting metallurgical bonding, were also found in the fracture surface. Regarding compression characteristics, the strain softening phenomenon, which is not a general tendency in room temperature deformation, appeared. This unique softening behavior was attributed to dynamic recovery and dynamic recrystallization during compression testing. Based on the above results, we discuss the tensile/compressive deformation behavior of the cold spray Cu bulk material, and predict compressive deformation behavior considering the constitutive equation.

Microstructure and Room Temperature Compressive Deformation Behavior of Cold-Sprayed High-Strength Cu Bulk Material

2017 ◽  
Vol 26 (7) ◽  
pp. 1498-1508 ◽  
Author(s):  
Young-Kyun Kim ◽  
Kyu-Sik Kim ◽  
Hyung-Jun Kim ◽  
Chan-Hee Park ◽  
Kee-Ahn Lee
Keyword(s):  
Deformation Behavior ◽  
Room Temperature ◽  
Bulk Material ◽  
High Strength ◽  
Compressive Deformation

scholarly journals SPH modeling of adhesion in fast dynamics: Application to the Cold Spray process

2016 ◽  
Vol 344 (4-5) ◽  
pp. 211-224 ◽  
Author(s):  
Paul Profizi ◽  
Alain Combescure ◽  
Kahuziro Ogawa
Keyword(s):  
Cold Spray ◽  
Cold Spray Process ◽  
Spray Process

Investigation on Zener-Hollomon Parameter in the Hot Compressive Deformation Behavior of SWRCH 35K

2013 ◽  
Vol 753-755 ◽  
pp. 241-244
Author(s):  
Peng Tian ◽  
Zhi Yong Zhong ◽  
Wei Jun Hui ◽  
Rui Guo Bai ◽  
Xing Li Zhang ◽  
...  
Keyword(s):  
Activation Energy ◽  
Strain Rate ◽  
Deformation Behavior ◽  
Deformation Rate ◽  
Deformation Temperature ◽  
Compressive Deformation ◽  
Stored Energy ◽  
Hollomon Parameter ◽  
Deformation Activation Energy ◽  
Quadratic Fitting

The hot compressive deformation behavior of SWRCH 35K was studied with uniaxial hot compression simulation tests at 923 ~ 1223 K and strain rate of 0.01 ~ 20 /s. The results show that the hot compressive deformation activation energy was 408 kJ/mol and the rang of deformation stored energy was 10 ~ 50 J/mol. The quadratic fitting expression between deformation stored energy and Zener-Hollomon parameter (Z) was established and the deformation stored energy was considered to increased with increasing Z or with lower deformation temperature and increasing deformation rate.

Significant influence of carrier gas temperature during the cold spray process

2014 ◽  
Vol 30 (6) ◽  
pp. 443-450 ◽  
Author(s):  
S. Yin ◽  
X. Suo ◽  
H. Liao ◽  
Z. Guo ◽  
X. Wang
Keyword(s):  
Cold Spray ◽  
Significant Influence ◽  
Gas Temperature ◽  
Cold Spray Process ◽  
Carrier Gas ◽  
Spray Process

scholarly journals Deposition of Copper Fine Particle by Cold Spray Process

2009 ◽  
Vol 50 (6) ◽  
pp. 1482-1488 ◽  
Author(s):  
Masahiro Fukumoto ◽  
Hiroki Terada ◽  
Masahiro Mashiko ◽  
Kazunori Sato ◽  
Motohiro Yamada ◽  
...  
Keyword(s):  
Cold Spray ◽  
Fine Particle ◽  
Cold Spray Process ◽  
Spray Process

Multi-walled carbon nanotube-reinforced copper nanocomposite coating fabricated by low-pressure cold spray process

2012 ◽  
Vol 206 (16) ◽  
pp. 3488-3494 ◽  
Author(s):  
Seungchan Cho ◽  
Kenta Takagi ◽  
Hansang Kwon ◽  
Dowon Seo ◽  
Kazuhiro Ogawa ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Cold Spray ◽  
Low Pressure ◽  
Nanocomposite Coating ◽  
Cold Spray Process ◽  
Spray Process ◽  
Multi Walled Carbon Nanotube
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