Thermomechanical properties of fibrous composites

Composites ◽  
1971 ◽  
Vol 2 (3) ◽  
pp. 192
Keyword(s):  
Thermomechanical Properties ◽  
Fibrous Composites

Thermomechanical properties of fibrous composites

1970 ◽  
Vol 319 (1536) ◽  
pp. 79-94 ◽  
Keyword(s):  
Thermomechanical Properties ◽  
Fibre Strength ◽  
Mechanical And Thermal Properties ◽  
Fibrous Composites ◽  
Rational Analysis ◽  
Specific Heats ◽  
Thermal Expansion Coefficients ◽  
Physical Response ◽  
Theoretical Results ◽  
Composite Properties

Basic composite properties can be related to those of their constituents by available theoretical results which are, on the one hand, relatively simple, and yet which are repre­sentative of the actual physical response of the materials. The present paper reviews recent developments in the theoretical analysis of the mechanical and thermal properties of fibrous composites. Comparisons with available experimental results are presented. Attention is focused on the properties of unidirectional fibrous composites. The definition of effective composite properties and methods for the analysis of the elastic moduli of such composites are reviewed. Theoretical results for composite thermal expansion coefficients and specific heats are presented. Tensile strength studies based on statistical failure models are then described. Effects of variations in fibre strength and of non-uniform stress distributions are treated. Finite length fibres and uniform strength fibres are also considered. Emphasis is placed upon demonstrating that the influence upon composite strength of the statistical nature of the strength of contemporary advanced filaments is susceptible to rational analysis.

scholarly journals The Thermal Conductivities of Periodic Fibrous Composites as Defined by a Mathematical Model

2017 ◽  
Author(s):  
John Venetis ◽  
Emilio Sideridis
Keyword(s):  
Thermal Conductivity ◽  
Mathematical Model ◽  
Periodic Structure ◽  
Geometric Model ◽  
Thermomechanical Properties ◽  
Fibrous Composites ◽  
Transverse Thermal Conductivity ◽  
Thermal Conductivities

In this paper, an advanced geometric model to simulate the periodic structure of unidirectional fibrous composites is presented. This model takes into consideration the influence of fiber contiguity in parallel with the concept of interphase on the thermomechanical properties of the overall material. Next, by the use of this model the authors propose closed – form expressions to estimate the longitudinal and transverse thermal conductivity of this type of composites.

scholarly journals The Thermal Conductivities of Periodic Fibrous Composites as Defined by a Mathematical Model

2017 ◽  
Author(s):  
John Venetis ◽  
Emilio Sideridis
Keyword(s):  
Reasonable Agreement ◽  
Thermomechanical Properties ◽  
Fibrous Composites ◽  
Multilayer Cylinder ◽  
Cylinder Model ◽  
Theoretical Predictions ◽  
The Matrix ◽  
Unit Cells ◽  
Transverse Thermal Conductivity ◽  
Advanced Model

In this paper, a geometric body-centered model to simulate the periodic structure of unidirectional fibrous composites is presented. To this end, three prescribed configurations are introduced to predict in a deterministic manner the arrangement of internal and neighboring fibers inside the matrix. Thus, three different representative volume elements (RVEs) are established. Furthermore, the concept of the interphase has been taken into account, stating that each individual fiber is encircled by a thin layer of variable thermomechanical properties. Next, these three unit cells are transformed in a unified manner to a coaxial multilayer cylinder model. This advanced model includes the influence of fiber contiguity in parallel with the interphase concept on the thermomechanical properties of the overall material. Then, by the use of this model, the authors propose explicit expressions to evaluate the longitudinal and transverse thermal conductivity of this type of composite. The theoretical predictions were compared with experimental results, as well as with theoretical values yielded by some reliable formulae derived from other workers, and a reasonable agreement was found.

Materials Issues and Characterization of Low-k Dielectric Materials

MRS Bulletin ◽  
1997 ◽  
Vol 22 (10) ◽  
pp. 49-54 ◽  
Author(s):  
E. Todd Ryan ◽  
Andrew J. McKerrow ◽  
Jihperng Leu ◽  
Paul S. Ho
Keyword(s):  
Process Integration ◽  
Dielectric Materials ◽  
Propagation Delay ◽  
Thermomechanical Properties ◽  
General Criterion ◽  
Crosstalk Noise ◽  
Total Delay ◽  
Interlayer Dielectrics ◽  
Performance Improvements ◽  
And Performance

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.

Thermomechanical properties of nanocomposites based on clinoptilolite and copolymer of ethylene with hexen

2020 ◽  
pp. 58-66
Author(s):  
N. T. Kakhramanov ◽  
◽  
I. V. Bayramova ◽  
S. S. Pesetsky ◽  
◽  
...  
Keyword(s):  
Thermomechanical Properties
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